In this study we demonstrate a new method for depositing thick reactive multilayer films (RMFs) (thickness > 14 μm) by using Ti interlayer integration and substrate preheating during fabrication. These two adjustments are designed to alleviate internal planar stresses that cause delamination between deposited layers and peeling off the substrate. Decreasing the distance between Ti interlayers helps to eliminate delamination between deposited layers. Through high speed camera measurements, the reaction propagation speed of an RMF sample with preheating is 42% slower than the same RMF that was not preheated, indicating a slower heat release rate. The preliminary experiments on brazing Ti-6Al-4V coated with BAlSi-4 brazing material revealed dendritic structure branching out from the RMF surface into the brazing material. The dendrite structures most likely form because of rapid melting and solidification of the brazing material. However, this rapid melting and solidification cycle does not appear to occur uniformly across the BAlSi-4RMF interface which is linked to its low bonding strength. When the Ti-6Al-4V substrate is heated to 150 °C prior to ignition, the strength increases to 0.47 MPa when the total RMF thickness is 84 μm and 15 MPa of pressure is applied.

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