Nanotwinned (nt) metals exhibit superior electrical and mechanical properties compared to their coarse-grained and nano-grained counterparts. They have a unique microstructure with grains that contain layered nanoscale twins divided by coherent twin boundaries (TBs). Since nanotwinned metals have low electrical resistivity and high resistance to electromigration, they are ideal materials for making nanowires, interconnections and switches. In this paper we show the possibility of making nanotwinned copper interconnections on a non-conductive substrate using a novel additive manufacturing technique called L-PED. Through this approach, microscale interconnections can be directly printed on the substrate in environmental conditions and without post processing.
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ASME 2018 13th International Manufacturing Science and Engineering Conference
June 18–22, 2018
College Station, Texas, USA
Conference Sponsors:
- Manufacturing Engineering Division
ISBN:
978-0-7918-5135-7
PROCEEDINGS PAPER
Printing of Microscale Nanotwinned Copper Interconnections Using Localized Pulsed Electrodeposition (L-PED) Available to Purchase
Ali Behroozfar,
Ali Behroozfar
University of Texas at Dallas, Richardson, TX
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Soheil Daryadel,
Soheil Daryadel
University of Texas at Dallas, Richardson, TX
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S. Reza Morsali,
S. Reza Morsali
University of Texas at Dallas, Richardson, TX
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Rodrigo A. Bernal,
Rodrigo A. Bernal
University of Texas at Dallas, Richardson, TX
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Majid Minary-Jolandan
Majid Minary-Jolandan
University of Texas at Dallas, Richardson, TX
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Ali Behroozfar
University of Texas at Dallas, Richardson, TX
Soheil Daryadel
University of Texas at Dallas, Richardson, TX
S. Reza Morsali
University of Texas at Dallas, Richardson, TX
Rodrigo A. Bernal
University of Texas at Dallas, Richardson, TX
Majid Minary-Jolandan
University of Texas at Dallas, Richardson, TX
Paper No:
MSEC2018-6365, V001T01A024; 4 pages
Published Online:
September 24, 2018
Citation
Behroozfar, A, Daryadel, S, Morsali, SR, Bernal, RA, & Minary-Jolandan, M. "Printing of Microscale Nanotwinned Copper Interconnections Using Localized Pulsed Electrodeposition (L-PED)." Proceedings of the ASME 2018 13th International Manufacturing Science and Engineering Conference. Volume 1: Additive Manufacturing; Bio and Sustainable Manufacturing. College Station, Texas, USA. June 18–22, 2018. V001T01A024. ASME. https://doi.org/10.1115/MSEC2018-6365
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