Double face grinding with planetary kinematics is a process used to manufacture workpieces with plane parallel functional surfaces. In order to increase the economic efficiency of this process, it has to be continuously developed. Tool optimization offers a huge potential as the tools are exposed to particular loads, due to the kinematics of the process. To fulfill this task, it is necessary to analyze the chip removal mechanisms, the kinematical coherences and the related tool wear. The main goal of the presented work is the reduction of the tool wear.

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