Prevalent general design methods and applications of compliant displacement amplifiers are focused on 1-DOF units composed into serial structures, which are limited by their output motions, stiffness, heat balance, repeatability and resonant frequencies. To improve the output properties of compliant displacement amplifiers, a monolithic structure is presented in the form of a compliant parallel mechanism. In the proposed moving structure, the compliant mechanism of the displacement amplifier is designed with 3-DOF to generate uniformly magnified output properties in all directions. High first resonant frequencies and amplification ratios are achieved in a compact size compared to existing compliant displacement amplifiers. The related kinematics, amplification ratios and resonant frequencies of the amplifier are analytically modeled, and the results are simulated by finite-element analysis. The proposed design is employable for micro/nano positioning stages operating within a prismatic output workspace.
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ASME 2013 International Manufacturing Science and Engineering Conference collocated with the 41st North American Manufacturing Research Conference
June 10–14, 2013
Madison, Wisconsin, USA
Conference Sponsors:
- Manufacturing Engineering Division
ISBN:
978-0-7918-5545-4
PROCEEDINGS PAPER
Design of a 3-DOF Compliant Parallel Mechanism for Displacement Amplification Available to Purchase
Qiang Zeng,
Qiang Zeng
Northwestern University, Evanston, IL
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Kornel F. Ehmann
Kornel F. Ehmann
Northwestern University, Evanston, IL
Search for other works by this author on:
Qiang Zeng
Northwestern University, Evanston, IL
Kornel F. Ehmann
Northwestern University, Evanston, IL
Paper No:
MSEC2013-1095, V001T01A049; 14 pages
Published Online:
November 27, 2013
Citation
Zeng, Q, & Ehmann, KF. "Design of a 3-DOF Compliant Parallel Mechanism for Displacement Amplification." Proceedings of the ASME 2013 International Manufacturing Science and Engineering Conference collocated with the 41st North American Manufacturing Research Conference. Volume 1: Processing. Madison, Wisconsin, USA. June 10–14, 2013. V001T01A049. ASME. https://doi.org/10.1115/MSEC2013-1095
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