Chip segmentation by deformation localization is an important process in a certain range of velocities and might be desirable in reducing cutting forces and by improving chips’ evacuation, whereas few studies of practical criteria to calculate shear band spacing are available in literature. This paper extends nonlinear dynamics model for chip segmentation by allowing time varying orientation of the shear plane that are pronounced in strain hardening materials. The model extends the non-linear dynamics approach with additional state variables to the Burns and Davies approach. The model is simulated numerically to predict the shear bands of the chip. The numerical simulation of the model is compared with experimental observations and is in agreement with experimental observations in Ti6Al4V. This offers guidance to predict shear band spacing of other materials.
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ASME 2013 International Manufacturing Science and Engineering Conference collocated with the 41st North American Manufacturing Research Conference
June 10–14, 2013
Madison, Wisconsin, USA
Conference Sponsors:
- Manufacturing Engineering Division
ISBN:
978-0-7918-5545-4
PROCEEDINGS PAPER
Chip Segmentation in Machining: A Study of Deformation Localization Characteristics in Ti6Al4V
Abhijit Chandra,
Abhijit Chandra
Iowa State University, Ames, IA
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Adam Bragg,
Adam Bragg
Flint Hills Resources, Rosemount, MN
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Gap Yong Kim
Gap Yong Kim
Iowa State University, Ames, IA
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Abhijit Chandra
Iowa State University, Ames, IA
Pavan Karra
Trine University, Angola, IN
Adam Bragg
Flint Hills Resources, Rosemount, MN
Jie Wang
Iowa State University, Ames, IA
Gap Yong Kim
Iowa State University, Ames, IA
Paper No:
MSEC2013-1070, V001T01A023; 7 pages
Published Online:
November 27, 2013
Citation
Chandra, A, Karra, P, Bragg, A, Wang, J, & Kim, GY. "Chip Segmentation in Machining: A Study of Deformation Localization Characteristics in Ti6Al4V." Proceedings of the ASME 2013 International Manufacturing Science and Engineering Conference collocated with the 41st North American Manufacturing Research Conference. Volume 1: Processing. Madison, Wisconsin, USA. June 10–14, 2013. V001T01A023. ASME. https://doi.org/10.1115/MSEC2013-1070
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