Perovskite materials have been widely embedded in many consumer and industrial electronics, both for capacitor applications in the case of dielectric materials, and for actuator, transducer and sensor applications in the case of piezoelectric materials. Functional devices used in high temperature environments, such as deep oil well instrumentation, geothermal exploration, and devices for aerospace applications require the persistence of materials’ properties at high temperatures. In this paper, high potential capacitor and piezoelectric ceramics for high temperature applications are presented. High dielectric constant (K) materials based on 0.8BaTiO3 – 0.2Bi(Zn1/2Ti1/2)O3 solid solutions have been shown to have superior properties for high temperature capacitor applications. Studies of the temperature dependence of the dielectric properties have shown that the composition with Ba vacancies exhibits a high relative permittivity (εr > 1150) and a low dielectric loss (tan δ < 0.05) that persist up to a temperature of 460 °C. This composition also shows a high resistivity in excess of 7.0 × 1010 Ω-cm which remains unchanged up to a temperature of 270 °C as well as a large RC time constant (RC > 20 s). In the case of high temperature piezoelectric ceramics, solid solutions of PbTiO3 – BiScO3 – Bi(M1/2Ti1/2)O3 ternary systems were studied, where M is Mg and Zn. The ratio of BiScO3 to Bi(M1/2Ti1/2)O3 was kept at 1:1, while the concentration of PbTiO3 was varied. X-ray diffraction patterns showed that tetragonal symmetry was observed in compositions which contain a high concentration of PbTiO3 (> 60 mol%). Evidence of a morphotropic phase boundary (MPB) was observed with compositions containing PbTiO3 in the range of 52–56 mol%. At 70 mol% PbTiO3 compositions, high Curie temperatures (TC) of 490 °C and 533 °C were observed for compositions containing Mg and Zn, respectively.
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ASME 2011 International Manufacturing Science and Engineering Conference
June 13–17, 2011
Corvallis, Oregon, USA
Conference Sponsors:
- Manufacturing Engineering Division
ISBN:
978-0-7918-4431-1
PROCEEDINGS PAPER
Dielectric and Piezoelectric Ceramics for High Temperature Applications Available to Purchase
Natthaphon Raengthon,
Natthaphon Raengthon
Oregon State University, Corvallis, OR
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Jason Nikkel,
Jason Nikkel
Oregon State University, Corvallis, OR
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Troy Ansell,
Troy Ansell
Oregon State University, Corvallis, OR
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David P. Cann
David P. Cann
Oregon State University, Corvallis, OR
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Natthaphon Raengthon
Oregon State University, Corvallis, OR
Jason Nikkel
Oregon State University, Corvallis, OR
Troy Ansell
Oregon State University, Corvallis, OR
David P. Cann
Oregon State University, Corvallis, OR
Paper No:
MSEC2011-50263, pp. 9-13; 5 pages
Published Online:
September 14, 2011
Citation
Raengthon, N, Nikkel, J, Ansell, T, & Cann, DP. "Dielectric and Piezoelectric Ceramics for High Temperature Applications." Proceedings of the ASME 2011 International Manufacturing Science and Engineering Conference. ASME 2011 International Manufacturing Science and Engineering Conference, Volume 2. Corvallis, Oregon, USA. June 13–17, 2011. pp. 9-13. ASME. https://doi.org/10.1115/MSEC2011-50263
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