Microvia formation technology using lasers has become the dominant method for drilling microvia called blind via-holes (BVHs) in printed wiring boards (PWBs). Laser direct drilling (LDD), drilling directly outer copper foil by laser, has attracted attention as a novel method. In particular, when copper and resin with different processing thresholds are drilled at the same time, an overhang defect occurs on the drilled hole. However, the overhang generation mechanism has not been clarified. Therefore, we investigated it by detailed observation of the drilled-hole section. Moreover, the overhang length was estimated using the finite element method (FEM). Influences of surface treatment of outer copper foil and thermal properties of the build-up layer were evaluated experimentally and analytically. Consequently, an experiment with a prototype PWB with silica filler added in the build-up layer was carried out. Using the prototype PWBs, the overhang was reduced as shown in FEM analysis results.
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ASME 2011 International Manufacturing Science and Engineering Conference
June 13–17, 2011
Corvallis, Oregon, USA
Conference Sponsors:
- Manufacturing Engineering Division
ISBN:
978-0-7918-4431-1
PROCEEDINGS PAPER
Microvia Formation for Multi-Layer PWB by Laser Direct Drilling: Improvement of Hole Quality by Silica Fillers in Build-Up Layer Available to Purchase
Keiji Ogawa,
Keiji Ogawa
The University of Shiga Prefecture, Hikone, Shiga, Japan
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Toshiki Hirogaki,
Toshiki Hirogaki
Doshisha University, Kyotanabe, Kyoto, Japan
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Eiichi Aoyama,
Eiichi Aoyama
Doshisha University, Kyotanabe, Kyoto, Japan
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Kuniyoshi Obata,
Kuniyoshi Obata
Doshisha University, Kyotanabe, Kyoto, Japan
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Tsukasa Ayuzawa
Tsukasa Ayuzawa
Doshisha University, Kyotanabe, Kyoto, Japan
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Keiji Ogawa
The University of Shiga Prefecture, Hikone, Shiga, Japan
Toshiki Hirogaki
Doshisha University, Kyotanabe, Kyoto, Japan
Eiichi Aoyama
Doshisha University, Kyotanabe, Kyoto, Japan
Kuniyoshi Obata
Doshisha University, Kyotanabe, Kyoto, Japan
Tsukasa Ayuzawa
Doshisha University, Kyotanabe, Kyoto, Japan
Paper No:
MSEC2011-50222, pp. 419-428; 10 pages
Published Online:
September 14, 2011
Citation
Ogawa, K, Hirogaki, T, Aoyama, E, Obata, K, & Ayuzawa, T. "Microvia Formation for Multi-Layer PWB by Laser Direct Drilling: Improvement of Hole Quality by Silica Fillers in Build-Up Layer." Proceedings of the ASME 2011 International Manufacturing Science and Engineering Conference. ASME 2011 International Manufacturing Science and Engineering Conference, Volume 2. Corvallis, Oregon, USA. June 13–17, 2011. pp. 419-428. ASME. https://doi.org/10.1115/MSEC2011-50222
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