To better predict the temperature distribution in the tool and chip, a modified theoretical model by considering material thermal properties as temperature dependent is developed to quantitatively describe the temperature elevation due to the shear and friction at the tool-chip interface. Work’s thermal properties of thermal conductivity and specific heat are modified and considered as functions of temperature. The semi-infinite method is utilized in the model, in which the back of the chip and the shear band are assumed as adiabatic. Temperature distribution in the tool and chip is then determined simultaneously by shear and friction. An imaginary heat source is set up to be plane-symmetric with respect to each original heat source in this approach. The effects of original heat source and imaginary heat source are superimposed to calculate the final temperature elevation in the tool and chip. To determine the ratio of total heat transferred into the chip and the tool, it is assumed that the temperatures in the tool and in the chip are in balance along the tool-chip interface in the stable cutting state. The model is experimentally validated with peak temperature data from previous literature. Results indicate that the model-experiment deviation is less than 10% when thermal properties are considered temperature dependent, and it is more accurate than that by considering the thermal properties as constants. The patterns of temperature distribution in the tool and chip are further analyzed by the model.
- Manufacturing Engineering Division
Theoretical Modeling of Cutting Temperature Distribution by Considering the Material Thermal Properties as Functions of Temperature
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Kang, Z, Ji, X, Zhang, X, & Liang, SY. "Theoretical Modeling of Cutting Temperature Distribution by Considering the Material Thermal Properties as Functions of Temperature." Proceedings of the ASME 2011 International Manufacturing Science and Engineering Conference. ASME 2011 International Manufacturing Science and Engineering Conference, Volume 1. Corvallis, Oregon, USA. June 13–17, 2011. pp. 225-232. ASME. https://doi.org/10.1115/MSEC2011-50216
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