In this work, preparation of discontinuous nickel films on zirconium by electrochemical deposition of Ni-Cu alloy followed by selective anodic etching of the more noble metal, copper, was performed in an aqueous solution at room temperature. Potential varying electrodeposition produces were applied to obtain Ni-Cu alloys on Zr substrate. It is found that the Ni content increases as the deposition potential becomes more negative. Cyclic voltam-metric data indicate that the anodic dissolution of nickel is retarded by passivation. By taking the advantage of nickel passivation, selective anodic etching of Cu is achieved. Multicyclic electrochemical alloying/dealloying process makes the film rich of nickel and complete dealloying of copper.

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