Laser-assisted cell direct-write technique has been a promising biomaterial direct-write method. For safe and reproducible cell direct writing, the cell damage due to process-induced external stress must be understood in addition to biological property research. The objective of this study is to model the thermoelastic stress wave propagation inside the coating in laser-assisted cell direct writing when the vaporization or optical breakdown of coating materials is not available. It is found that a bipolar pressure pair has been developed within a finite thin coating medium, locations near the laser focal spot experience higher stresses, and shorter duration laser pulses lead to higher thermoelastic stresses. This study will help understand the photomechanical stress and its relevance with biomaterial damage in laser-assisted cell direct writing.
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ASME 2009 International Manufacturing Science and Engineering Conference
October 4–7, 2009
West Lafayette, Indiana, USA
Conference Sponsors:
- Manufacturing Engineering Division
ISBN:
978-0-7918-4362-8
PROCEEDINGS PAPER
Modeling of Thermoelastic Stress Wave in Laser-Assisted Cell Direct Writing
Yafu Lin
Yafu Lin
Clemson University, Clemson, SC
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Wei Wang
Clemson University, Clemson, SC
Yong Huang
Clemson University, Clemson, SC
Yafu Lin
Clemson University, Clemson, SC
Paper No:
MSEC2009-84373, pp. 705-712; 8 pages
Published Online:
September 20, 2010
Citation
Wang, W, Huang, Y, & Lin, Y. "Modeling of Thermoelastic Stress Wave in Laser-Assisted Cell Direct Writing." Proceedings of the ASME 2009 International Manufacturing Science and Engineering Conference. ASME 2009 International Manufacturing Science and Engineering Conference, Volume 2. West Lafayette, Indiana, USA. October 4–7, 2009. pp. 705-712. ASME. https://doi.org/10.1115/MSEC2009-84373
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