Thin film shape memory alloys have recently become a promising material for actuation of devices on the micro scale such as micro-pumps and micro-valves. Their utilization, however, has been limited due to the difficulty in tailoring their properties for different applications. Control over the transformation temperatures as well as mechanical and shape memory properties is required to enable their widespread use. This study examines the effects of heat treatment time and temperature on the properties of amorphous, Ti-rich NiTi thin films on silicon substrates. The effects on the transformation temperatures are investigated through the use of temperature dependent optical microscopy. The modulus and hardness, as well as dissipated energy and depth recovery are obtained through nano-indentation and atomic force microscopy (AFM). The role of microstructure and composition in altering both the mechanical and shape memory properties of the films is discussed.
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ASME 2009 International Manufacturing Science and Engineering Conference
October 4–7, 2009
West Lafayette, Indiana, USA
Conference Sponsors:
- Manufacturing Engineering Division
ISBN:
978-0-7918-4362-8
PROCEEDINGS PAPER
Shape Memory Property Alteration of Amorphous NiTi Thin Films Through Aging Heat Treatment
Andrew Birnbaum,
Andrew Birnbaum
Columbia University, New York, NY
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Y. Lawrence Yao
Y. Lawrence Yao
Columbia University, New York, NY
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Gen Satoh
Columbia University, New York, NY
Andrew Birnbaum
Columbia University, New York, NY
Y. Lawrence Yao
Columbia University, New York, NY
Paper No:
MSEC2009-84364, pp. 637-646; 10 pages
Published Online:
September 20, 2010
Citation
Satoh, G, Birnbaum, A, & Yao, YL. "Shape Memory Property Alteration of Amorphous NiTi Thin Films Through Aging Heat Treatment." Proceedings of the ASME 2009 International Manufacturing Science and Engineering Conference. ASME 2009 International Manufacturing Science and Engineering Conference, Volume 2. West Lafayette, Indiana, USA. October 4–7, 2009. pp. 637-646. ASME. https://doi.org/10.1115/MSEC2009-84364
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