This study investigates modeling of microgrinding of ceramic materials by cohesive zone method (CZM) and Finite element analysis (FEA). A maximum grinding chip thickness model, which considers detail diamond profile and tool deflection, is developed in this study. The chip thickness model is then implemented in FEA to predict peak grinding force in grinding alumina. The simulation result is compared with experimental result for a specific diamond on the microgrinding tool. The feasibility of modeling ceramic microgrinding by CZM based FEA is then discussed.

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