A unified simple predictive model has been presented for high fluence ultrashort laser ablation of metal, semiconductor and dielectric, which has very low computational cost and is very easy to apply. Unlike many other simplified models, this model does not involve any free adjustable variables. The model predictions agree well with experimental measurements for femtosecond laser ablation, while the model is not very applicable for pulse durations more than ∼10 picosecond.

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