Recently, the achievement of further high flatness of workpiece edge shape is strongly required in mirror finishing. Especially, the edge roll off of silicon wafers as the substrates of semiconductor devices is demanded to decrease in the polishing process for raising the yield of IC chips. Many theoretical and experimental analyses of the edge roll off generation have been already done and the polishing methods for suppressing the roll off have been proposed to meet the demand. The analyses, however, cannot fully account for the obtained edge shape in actual polishing and the problem about the roll off remains. In this study, the generation mechanism of the edge roll off based on the viscoelasticity of polishing pad was newly proposed. The mechanism considered the horizontal and vertical relative static and dynamic motion between the pad and the workpiece. Moreover, the non-contact viscoelasticity measurement instrument was originally developed to evaluate the viscoelasticity of the polishing pad precisely. A series of polishing experiments for silicon wafers revealed that the edge shape, which was induced from the edge roll off generation mechanism and the measured viscoelasticity of the polishing pad, corresponded well with the obtained edge shape.
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ASME 2009 International Manufacturing Science and Engineering Conference
October 4–7, 2009
West Lafayette, Indiana, USA
Conference Sponsors:
- Manufacturing Engineering Division
ISBN:
978-0-7918-4361-1
PROCEEDINGS PAPER
The Edge Roll Off Generation Mechanism in Polishing by Considering the Viscoelasticity of Polishing Pads Available to Purchase
Takahiro Miyake,
Takahiro Miyake
Osaka University, Suita, Osaka, Japan
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Toshiyuki Enomoto,
Toshiyuki Enomoto
Osaka University, Suita, Osaka, Japan
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Kenji Hirose
Kenji Hirose
Osaka University, Suita, Osaka, Japan
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Takahiro Miyake
Osaka University, Suita, Osaka, Japan
Toshiyuki Enomoto
Osaka University, Suita, Osaka, Japan
Kenji Hirose
Osaka University, Suita, Osaka, Japan
Paper No:
MSEC2009-84063, pp. 677-682; 6 pages
Published Online:
September 20, 2010
Citation
Miyake, T, Enomoto, T, & Hirose, K. "The Edge Roll Off Generation Mechanism in Polishing by Considering the Viscoelasticity of Polishing Pads." Proceedings of the ASME 2009 International Manufacturing Science and Engineering Conference. ASME 2009 International Manufacturing Science and Engineering Conference, Volume 1. West Lafayette, Indiana, USA. October 4–7, 2009. pp. 677-682. ASME. https://doi.org/10.1115/MSEC2009-84063
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