Residual stress prediction in hard turning has been recognized as one of the most important and challenging tasks. A hybrid finite element predictive model has been developed with the concept of plowed depth to predict residual stress profiles in hard turning. With the thermo-mechanical work material properties, residual stress has been predicted by simulating the dynamic turning process followed by a quasi-static stress relaxation process. The residual stress profiles were predicted for a series of plowed depths potentially encountered in machining. The predicted residual stress profiles agree with the experimental one in general. A transition of residual stress profile has been recovered at the critical plowed depth. In addition, the effects of cutting speed, friction coefficient and inelastic heat coefficient on residual stress profiles have also been studied and explained.
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ASME 2009 International Manufacturing Science and Engineering Conference
October 4–7, 2009
West Lafayette, Indiana, USA
Conference Sponsors:
- Manufacturing Engineering Division
ISBN:
978-0-7918-4361-1
PROCEEDINGS PAPER
A New Finite Element Approach Without Chip Formation to Predict Residual Stress Profile Patterns in Metal Cutting
S. Anurag,
S. Anurag
The University of Alabama, Tuscaloosa, AL
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Y. B. Guo,
Y. B. Guo
The University of Alabama, Tuscaloosa, AL
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Z. Q. Liu
Z. Q. Liu
Shandong University, Jinan, China
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S. Anurag
The University of Alabama, Tuscaloosa, AL
Y. B. Guo
The University of Alabama, Tuscaloosa, AL
Z. Q. Liu
Shandong University, Jinan, China
Paper No:
MSEC2009-84236, pp. 419-426; 8 pages
Published Online:
September 20, 2010
Citation
Anurag, S, Guo, YB, & Liu, ZQ. "A New Finite Element Approach Without Chip Formation to Predict Residual Stress Profile Patterns in Metal Cutting." Proceedings of the ASME 2009 International Manufacturing Science and Engineering Conference. ASME 2009 International Manufacturing Science and Engineering Conference, Volume 1. West Lafayette, Indiana, USA. October 4–7, 2009. pp. 419-426. ASME. https://doi.org/10.1115/MSEC2009-84236
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