Microfluidics is both a science and a technology that offers great and perhaps even revolutionary capabilities to impact the society in the future. Polydimethylsiloxane (PDMS) has been widely used in fabricating microfluidic systems but few efforts were made in the past on mechanical properties of PDMS. Very importantly there is no report on influences of microfabrication processes which normally involve chemical reaction processes. A comprehensive investigation was made by authors to study fundamental issues regarding chemical emersion and their effects on mechanical properties of PDMS. Results shown in this work can be used to guide future developments of microfluidics in utilizing PDMS especially those devices involve actuation of PDMS membranes.
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ASME 2008 International Manufacturing Science and Engineering Conference collocated with the 3rd JSME/ASME International Conference on Materials and Processing
October 7–10, 2008
Evanston, Illinois, USA
Conference Sponsors:
- Manufacturing Engineering Division
ISBN:
978-0-7918-4852-4
PROCEEDINGS PAPER
Mechanical Properties of PDMS and Influences by Micromachining Processes
Jianren Sun,
Jianren Sun
University of Central Florida, Orlando, FL
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Christopher Bock,
Christopher Bock
University of Central Florida, Orlando, FL
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Quanfang Chen
Quanfang Chen
University of Central Florida, Orlando, FL
Search for other works by this author on:
Jianren Sun
University of Central Florida, Orlando, FL
Christopher Bock
University of Central Florida, Orlando, FL
Quanfang Chen
University of Central Florida, Orlando, FL
Paper No:
MSEC_ICM&P2008-72296, pp. 543-549; 7 pages
Published Online:
July 24, 2009
Citation
Sun, J, Bock, C, & Chen, Q. "Mechanical Properties of PDMS and Influences by Micromachining Processes." Proceedings of the ASME 2008 International Manufacturing Science and Engineering Conference collocated with the 3rd JSME/ASME International Conference on Materials and Processing. ASME 2008 International Manufacturing Science and Engineering Conference, Volume 2. Evanston, Illinois, USA. October 7–10, 2008. pp. 543-549. ASME. https://doi.org/10.1115/MSEC_ICMP2008-72296
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