Cell damage due to the mechanical impact during laser-assisted cell direct writing has been observed and is a possible hurdle for broad applications of fragile cell direct writing. The objective of this study is to numerically investigate the bubble expansion-induced cell mechanical loading profile in laser-assisted cell direct writing. Some conclusions have been drawn as follows. The cell velocity oscillates initially and then smoothes out gradually with a constant ejection velocity. Both the cell acceleration and pressure can be very high at the beginning period of bubble expansion and then quickly approaches zero in an oscillation manner. A high viscosity can lead to an observable velocity increment at the initial stage, but the ejection velocity decreases. The pressure magnitude decreases when the distance is large, and a larger initial pressure induces a larger cell pressure as expected. This study serves as a foundation to further investigate the cell damage mechanism in laser-assisted cell direct writing to improve the effectiveness and efficiency of cell direct writing techniques.
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ASME 2008 International Manufacturing Science and Engineering Conference collocated with the 3rd JSME/ASME International Conference on Materials and Processing
October 7–10, 2008
Evanston, Illinois, USA
Conference Sponsors:
- Manufacturing Engineering Division
ISBN:
978-0-7918-4852-4
PROCEEDINGS PAPER
Modeling of Bubble Expansion-Induced Cell Mechanical Profile in Laser-Assisted Cell Direct Writing
Yong Huang
Yong Huang
Clemson University, Clemson, SC
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Wei Wang
Clemson University, Clemson, SC
Gang Li
Clemson University, Clemson, SC
Yong Huang
Clemson University, Clemson, SC
Paper No:
MSEC_ICM&P2008-72242, pp. 505-514; 10 pages
Published Online:
July 24, 2009
Citation
Wang, W, Li, G, & Huang, Y. "Modeling of Bubble Expansion-Induced Cell Mechanical Profile in Laser-Assisted Cell Direct Writing." Proceedings of the ASME 2008 International Manufacturing Science and Engineering Conference collocated with the 3rd JSME/ASME International Conference on Materials and Processing. ASME 2008 International Manufacturing Science and Engineering Conference, Volume 2. Evanston, Illinois, USA. October 7–10, 2008. pp. 505-514. ASME. https://doi.org/10.1115/MSEC_ICMP2008-72242
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