Matrix-assisted pulsed-laser evaporation direct write (MAPLE DW) is emerging as a promising direct-write technology for printing microelectronics as well as biological constructs. To widely employ this technology, understanding of its physical mechanism is of need. In this study, the bubble formation process in MAPLE DW of glycerol-water coating is modeled based on the nucleation-based phase explosion theory. Based on the proposed model, the bubble diameter after expansion and cooling and bubble pressure can be predicted. Although the prediction overall overestimates the bubble diameter during the MAPLE DW experiments, the proposed model is considered satisfactory in reasonably predicting the bubble diameter as a first step endeavor for this complex process. It is expected that the introduction of more accurate models for energy loss should further help improve the model prediction accuracy.
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ASME 2008 International Manufacturing Science and Engineering Conference collocated with the 3rd JSME/ASME International Conference on Materials and Processing
October 7–10, 2008
Evanston, Illinois, USA
Conference Sponsors:
- Manufacturing Engineering Division
ISBN:
978-0-7918-4852-4
PROCEEDINGS PAPER
Bubble Formation Modeling in Matrix-Assisted Pulsed-Laser Evaporation Direct Write
Douglas B. Chrisey
Douglas B. Chrisey
Rensselaer Polytechnic Institute, Troy, NY
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Yafu Lin
Clemson University, Clemson, SC
Kevin Foy
Clemson University, Clemson, SC
Yong Huang
Clemson University, Clemson, SC
Douglas B. Chrisey
Rensselaer Polytechnic Institute, Troy, NY
Paper No:
MSEC_ICM&P2008-72241, pp. 497-504; 8 pages
Published Online:
July 24, 2009
Citation
Lin, Y, Foy, K, Huang, Y, & Chrisey, DB. "Bubble Formation Modeling in Matrix-Assisted Pulsed-Laser Evaporation Direct Write." Proceedings of the ASME 2008 International Manufacturing Science and Engineering Conference collocated with the 3rd JSME/ASME International Conference on Materials and Processing. ASME 2008 International Manufacturing Science and Engineering Conference, Volume 2. Evanston, Illinois, USA. October 7–10, 2008. pp. 497-504. ASME. https://doi.org/10.1115/MSEC_ICMP2008-72241
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