Past research has shown that scatter in material properties and springback (i.e., the elastic recovery of material after the tooling is extracted) increase as components are miniaturized to the microscale. At the macroscale, electromagnetic forming (EMF) has been shown to completely eliminate or at least decrease springback by varying the deformation mechanism. In EMF, a capacitor bank is charged and then quickly dissipated into a specially designed magnetic coil. A transient magnetic field is produced which induces eddy currents in the workpiece, and any other conductive material nearby. The magnetic fields in the coil and the workpiece are repulsive; thus, the workpiece is launched at a high velocity away from the coil. EMF at the macroscale requires a significant amount of stored energy. However at the microscale, EMF may be a viable process due to the reduced energy and force requirements and thus is being investigated in this work.
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ASME 2008 International Manufacturing Science and Engineering Conference collocated with the 3rd JSME/ASME International Conference on Materials and Processing
October 7–10, 2008
Evanston, Illinois, USA
Conference Sponsors:
- Manufacturing Engineering Division
ISBN:
978-0-7918-4852-4
PROCEEDINGS PAPER
Microscale Flanging Using Quasi-Static and Electromagnetic Forming Processes
Reid VanBenthysen,
Reid VanBenthysen
University of New Hampshire, Durham, NH
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Jonathan Michaud,
Jonathan Michaud
University of New Hampshire, Durham, NH
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Peter DiSalvo,
Peter DiSalvo
University of New Hampshire, Durham, NH
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Brad L. Kinsey,
Brad L. Kinsey
University of New Hampshire, Durham, NH
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Michael Blakely,
Michael Blakely
Hirotec America, Auburn Hills, MI
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Jianhui Shang
Jianhui Shang
Hirotec America, Auburn Hills, MI
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Reid VanBenthysen
University of New Hampshire, Durham, NH
Jonathan Michaud
University of New Hampshire, Durham, NH
Peter DiSalvo
University of New Hampshire, Durham, NH
Brad L. Kinsey
University of New Hampshire, Durham, NH
Michael Blakely
Hirotec America, Auburn Hills, MI
Jianhui Shang
Hirotec America, Auburn Hills, MI
Paper No:
MSEC_ICM&P2008-72135, pp. 447-455; 9 pages
Published Online:
July 24, 2009
Citation
VanBenthysen, R, Michaud, J, DiSalvo, P, Kinsey, BL, Blakely, M, & Shang, J. "Microscale Flanging Using Quasi-Static and Electromagnetic Forming Processes." Proceedings of the ASME 2008 International Manufacturing Science and Engineering Conference collocated with the 3rd JSME/ASME International Conference on Materials and Processing. ASME 2008 International Manufacturing Science and Engineering Conference, Volume 2. Evanston, Illinois, USA. October 7–10, 2008. pp. 447-455. ASME. https://doi.org/10.1115/MSEC_ICMP2008-72135
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