Molecular Dynamics (MD) simulations of nanometric machining of single-crystal copper were conducted at a conventional cutting speed (5m/s) and different depths of cut (0.724 – 2.172 nm). The simulations were carried out to predict cutting forces and investigate the mechanism of chip formation at the nano level. The effect of tool rake angles and depths of cut on the mechanism of chip formation were also investigated. Tools with different rake angles, namely 0°, 5°, 10°, 15°, 30°, and 45°, were used. It was found that the cutting force, thrust force, and the ratio of the thrust force to cutting force decrease with increasing rake angle. However, the ratio of the thrust force to the cutting force is found to be independent of the depth of cut.
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ASME 2008 International Manufacturing Science and Engineering Conference collocated with the 3rd JSME/ASME International Conference on Materials and Processing
October 7–10, 2008
Evanston, Illinois, USA
Conference Sponsors:
- Manufacturing Engineering Division
ISBN:
978-0-7918-4852-4
PROCEEDINGS PAPER
Molecular Dynamics Simulation of Nanometric Machining Under Realistic Cutting Conditions
R. Promyoo,
R. Promyoo
Indiana University Purdue University Indianapolis, Indianapolis, IN
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H. El-Mounayri,
H. El-Mounayri
Indiana University Purdue University Indianapolis, Indianapolis, IN
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X. Yang
X. Yang
Indiana University Purdue University Indianapolis, Indianapolis, IN
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R. Promyoo
Indiana University Purdue University Indianapolis, Indianapolis, IN
H. El-Mounayri
Indiana University Purdue University Indianapolis, Indianapolis, IN
X. Yang
Indiana University Purdue University Indianapolis, Indianapolis, IN
Paper No:
MSEC_ICM&P2008-72533, pp. 235-243; 9 pages
Published Online:
July 24, 2009
Citation
Promyoo, R, El-Mounayri, H, & Yang, X. "Molecular Dynamics Simulation of Nanometric Machining Under Realistic Cutting Conditions." Proceedings of the ASME 2008 International Manufacturing Science and Engineering Conference collocated with the 3rd JSME/ASME International Conference on Materials and Processing. ASME 2008 International Manufacturing Science and Engineering Conference, Volume 2. Evanston, Illinois, USA. October 7–10, 2008. pp. 235-243. ASME. https://doi.org/10.1115/MSEC_ICMP2008-72533
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