Tearing failure in sheet metal forming has traditionally been predicted based on the strain state of the material. However, a concern with this failure prediction method is that the strain based forming limit curve exhibits significant strain path dependence. A stress based failure criterion has been proposed and shown to be less sensitive to the strain path through numerical simulations and by analytically converting strain based data to stress space. However, a means to predict this stress based failure criterion without prior knowledge of the strain based forming limit curve for sheet metal is required. In this paper, an analytical prediction of the stress based forming limit curve is derived and compared to experimental and numerical results. The effects of model parameters are also investigated.
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ASME 2008 International Manufacturing Science and Engineering Conference collocated with the 3rd JSME/ASME International Conference on Materials and Processing
October 7–10, 2008
Evanston, Illinois, USA
Conference Sponsors:
- Manufacturing Engineering Division
ISBN:
978-0-7918-4851-7
PROCEEDINGS PAPER
The Effect of Model Parameters on Predicted Stress Based Failure Criterion for Sheet Metal
Matthew J. Derov,
Matthew J. Derov
University of New Hampshire, Durham, NH
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Brad L. Kinsey,
Brad L. Kinsey
University of New Hampshire, Durham, NH
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Igor Tsukrov
Igor Tsukrov
University of New Hampshire, Durham, NH
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Matthew J. Derov
University of New Hampshire, Durham, NH
Brad L. Kinsey
University of New Hampshire, Durham, NH
Igor Tsukrov
University of New Hampshire, Durham, NH
Paper No:
MSEC_ICM&P2008-72136, pp. 571-576; 6 pages
Published Online:
July 24, 2009
Citation
Derov, MJ, Kinsey, BL, & Tsukrov, I. "The Effect of Model Parameters on Predicted Stress Based Failure Criterion for Sheet Metal." Proceedings of the ASME 2008 International Manufacturing Science and Engineering Conference collocated with the 3rd JSME/ASME International Conference on Materials and Processing. ASME 2008 International Manufacturing Science and Engineering Conference, Volume 1. Evanston, Illinois, USA. October 7–10, 2008. pp. 571-576. ASME. https://doi.org/10.1115/MSEC_ICMP2008-72136
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