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Keywords: Thermal Resistance
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Proceedings Papers

A Novel Thermal Solution for Electronics: Alumina Flat-Plate Oscillating Heat Pipe

Bohan Tian, Hongbin Ma, Yang Deming, Jiujun Xu, Zhiyong Wang, Nannan Zhao
Proc. ASME. MNHMT2019, ASME 2019 6th International Conference on Micro/Nanoscale Heat and Mass Transfer, V001T12A002, July 8–10, 2019
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2019-3936
https://doi.org/10.1115/MNHMT2019-3936
... is embedded inside the alumina and charged with water, the thermal resistance can be reduced by 97%. oscillating heat pipe (OHP) alumina heat transfer thermal resistance A NOVEL THERMAL SOLUTION FOR ELECTRONICS: ALUMINA FLAT-PLATE OSCILLATING HEAT PIPE Bohan Tian1 Dalian Maritime University Dalian...
View Paper titled, A Novel Thermal Solution for Electronics: Alumina Flat-Plate Oscillating Heat Pipe
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Topics: Electronics, Flat plates, Heat pipes, Heat transfer, Thermal resistance
Proceedings Papers

Analysis of Laminar Heat Transfer on Super-Hydrophobic Surface With Slip Velocity

Wei Sun, Yuhong Zhou, Xinxin Fan, Tianqing Liu
Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 2, 527-534, December 18–21, 2009
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2009-18155
https://doi.org/10.1115/MNHMT2009-18155
... was proposed and the thermal resistance of the surface with trapped air was calculated. Finally, the effective heat transfer coefficient of super-hydrophobic surface was found with the integration of heat transfer coefficient and surface thermal resistance. The calculation results show that 1) the slip...
View Paper titled, Analysis of Laminar Heat Transfer on Super-Hydrophobic Surface With Slip Velocity
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Topics: Heat transfer, Heat transfer coefficients, Thermal resistance, Heat flux, Temperature profiles, Convection, Fluids, Heat conduction, Microchannels
Proceedings Papers

A Molecular Dynamics Study on the Effects of Nanostructural Clearances on Thermal Resistance at a Liquid-Solid Interface

Masahiko Shibahara, Kiyoshi Takeuchi
Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 3, 119-124, December 18–21, 2009
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2009-18197
https://doi.org/10.1115/MNHMT2009-18197
...Proceedings of MNHMT2009 ASME 2009 2nd Micro/Nanoscale Heat & Mass Transfer International Conference December 18-22, 2009, Shanghai, China MNHMT2009-18197 A MOLECULAR DYNAMICS STUDY ON THE EFFECTS OF NANOSTRUCTURAL CLEARANCES ON THERMAL RESISTANCE AT A LIQUID SOLID INTERFACE Masahiko SHIBAHARA1...
View Paper titled, A Molecular Dynamics Study on the Effects of Nanostructural Clearances on <span class="search-highlight">Thermal</span> <span class="search-highlight">Resistance</span> at a Liquid-Solid Interface
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Topics: Molecular dynamics, Thermal resistance
Proceedings Papers

Measurements for the Moisture Permeations and Thermal Resistances of Cyclo Olefin Copolymer Substrates Deposited a Silicon Dioxide Film

Rong-Yuan Jou
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 867-872, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52130
https://doi.org/10.1115/MNHT2008-52130
... and thermal barrier characteristics of the COC/SiO2 structure. Keywords: thermoplastic substrate, cyclo olefin copolymer, permeation, thermal resistance, water vapor transmission rate (WVTR), IR thermography NOMENCLATURE k thermal conductivity of substrate or thin film x thickness of substrate or thin film q...
View Paper titled, Measurements for the Moisture Permeations and <span class="search-highlight">Thermal</span> <span class="search-highlight">Resistances</span> of Cyclo Olefin Copolymer Substrates Deposited a Silicon Dioxide Film
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Topics: Copolymers, Silicon, Thermal resistance, Thermography
Proceedings Papers

Investigation on the Steady Thermal Resistance of Axial Grooved Heat Pipe (AGHP)

Hanzhong Tao, Hong Zhang, Jun Zhuang
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 931-940, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52021
https://doi.org/10.1115/MNHT2008-52021
... 23 06 2009 According to the classic thermal resistance network model of the heat pipe, a quasi-two-dimensional theoretical thermal resistance model for the horizontal axial grooved heat pipe (AGHP) under normal conditions is presented. The contact type between liquid working fluid...
View Paper titled, Investigation on the Steady <span class="search-highlight">Thermal</span> <span class="search-highlight">Resistance</span> of Axial Grooved Heat Pipe (AGHP)
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Topics: Heat pipes, Thermal resistance