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Keywords: Electronics cooling
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Proceedings Papers

Proc. ASME. MNHMT2013, ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer, V001T11A010, December 11–14, 2013
Paper No: MNHMT2013-22198
... 1 Copyright © 2013 by ASME THERMAL PERFORMANCE OF MICROCHANNELS WITH DIMPLES FOR ELECTRONICS COOLING Hui Lu Dept. of Thermal Energy & Power Engineering, China University of Petroleum Qingdao, Shandong, China Liang Gong* Dept. of Thermal Energy & Power Engineering, China University of Petroleum...
Proceedings Papers

Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 909-916, March 3–6, 2012
Paper No: MNHMT2012-75312
.... Electronics cooling Forced convection Free-molecular flow kinetic theory HEAT TRANSFER AND PRESSURE DROP THROUGH NANO-FIN ARRAYS IN THE FREE-MOLECULAR FLOW REGIME Michael James Martin Assistant Professor Louisiana State University Department of Mechanical Engineering Baton Rouge, Louisiana 70803, USA...
Proceedings Papers

Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 411-417, March 3–6, 2012
Paper No: MNHMT2012-75271
... to jet impinging on a plain copper surface under similar working conditions, a 248% performance enhancement is obtained with the porous surface. jet impingement nucleate flow boiling heat surface enhancement porous wire mesh high-flux surface electronics cooling 1 Copyright © 2012 by...
Proceedings Papers

Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 3, 389-394, December 18–21, 2009
Paper No: MNHMT2009-18233
... obtained and the working performance of the magnetic fluid is compared with that of the water flat pate heat pipe of the same geometry structure. Keywords: magnetic fluid; flat plate heat pipe; electronics cooling 1. INTRODUCTION The magnetic fluid is a colloidal solution of many ultrafine magnetic...
Proceedings Papers

Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 3, 259-263, December 18–21, 2009
Paper No: MNHMT2009-18370
..., electronics cooling, mobile computing INTRODUCTION With the development and popularization of portable communication, entertainment and computing, more and more functionality and performance are squeezed into handheld microelectronic devices [1]. The power consumptions of these devices, as an inevitable...
Proceedings Papers

Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 3, 553-567, December 18–21, 2009
Paper No: MNHMT2009-18548
... described Attention is devoted to thermoelectric microcoolers using mini-contcat enhancement and in-plane thermoelectric currents, orthotropic TIM s/heat spreaders, and phase-change microgap coolers. Keywords: Hot Spot, Electronics Cooling, Termoelectric Cooler, Anisotropic Heat Spreader, Microgap Cooler...
Proceedings Papers

Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 923-929, June 6–9, 2008
Paper No: MNHT2008-52017
... vapor chamber electronics cooling grooved structure An effective thermal spreader can achieve more uniform heat flux distribution and thus enhance heat dissipation of heat sinks. Vapor chamber is one of highly effective thermal spreaders. In this paper, a novel grooved vapor chamber was...
Topics: Vapors
Proceedings Papers

Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 671-677, June 6–9, 2008
Paper No: MNHT2008-52117
... Microchannel Microchannel Optimization Electronics Cooling Heat Sinks A computational model was developed to analyze and optimize the convective heat transfer for water flowing through rectangular microchannels fabricated in a silicon substrate. A baseline case was analyzed by solving...