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Proceedings Papers

An Experimental Study on the Thermal Performance of the Flat Heat Pipe

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Hao Xiaohong, Jiqing Guan, Jingbo Zhao
Proc. ASME. MNHMT2016, Volume 2: Micro/Nano-Thermal Manufacturing and Materials Processing; Boiling, Quenching and Condensation Heat Transfer on Engineered Surfaces; Computational Methods in Micro/Nanoscale Transport; Heat and Mass Transfer in Small Scale; Micro/Miniature Multi-Phase Devices; Biomedical Applications of Micro/Nanoscale Transport; Measurement Techniques and Thermophysical Properties in Micro/Nanoscale; Posters, V002T12A002, January 4–6, 2016
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2016-6496
https://doi.org/10.1115/MNHMT2016-6496
View Paper titled, An Experimental Study on the Thermal Performance of the Flat Heat Pipe
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Topics: Flat heat pipes, Heat transfer, Cooling, Fluids, Nanofluids, Water, Heat, Heat flux, Condensers (steam plant), Convection
Proceedings Papers

Surface Modifications of Bulk Micromachined Titanium Pillar Arrays: A Wick Material for Thin Flat Heat Pipes

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Changsong Ding, Carl D. Meinhart, Noel C. MacDonald
Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 2, 415-419, December 18–21, 2009
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2009-18195
https://doi.org/10.1115/MNHMT2009-18195
View Paper titled, Surface Modifications of Bulk Micromachined Titanium Pillar Arrays: A Wick Material for Thin Flat Heat Pipes
Open the PDF for Surface Modifications of Bulk Micromachined Titanium Pillar Arrays: A Wick Material for Thin Flat Heat Pipes in another window
Topics: Columns (Structural), Condensers (steam plant), Flat heat pipes, Heat pipes, Micromachining, Titanium, Wetting
Proceedings Papers

Development of Silicon Based Heat Spreader for High Power Electronic Devices

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Qingjun Cai, Bing-chung Chen, Chailun Tsai, Yuan Zhao, Chung-lung Chen
Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 3, 443-448, December 18–21, 2009
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2009-18499
https://doi.org/10.1115/MNHMT2009-18499
View Paper titled, Development of Silicon Based Heat Spreader for High Power Electronic Devices
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Topics: Flat heat pipes, Silicon
Proceedings Papers

Performances of Flat Plate Pulsating Heat Pipes

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Wei Qu, Bin Yang
Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 3, 403-410, December 18–21, 2009
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2009-18358
https://doi.org/10.1115/MNHMT2009-18358
View Paper titled, Performances of Flat Plate Pulsating Heat Pipes
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Topics: Flat heat pipes, Flat plates, Heat flux, Heat pipes
Proceedings Papers

Thermal Management of On-Chip Hot Spot

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Avram Bar-Cohen, Peng Wang
Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 3, 553-567, December 18–21, 2009
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2009-18548
https://doi.org/10.1115/MNHMT2009-18548
View Paper titled, Thermal Management of On-Chip Hot Spot
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Topics: Flat heat pipes, Thermal management, Heat flux, Anisotropy, Computer cooling, Coolers, Cooling, Currents, Density, Electronics