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Proceedings Papers

Experimental and Theoretical Study on the Effect of Pressure and Surface Roughness on Thermal Contact Resistance With LMA As TIM

Yulong Ji, Jiantong Xu, Weichen Gao, Huilong Yan, Fengmin Su, Hongbin Ma
Proc. ASME. MNHMT2019, ASME 2019 6th International Conference on Micro/Nanoscale Heat and Mass Transfer, V001T11A010, July 8–10, 2019
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2019-4083
https://doi.org/10.1115/MNHMT2019-4083
View Paper titled, Experimental and Theoretical Study on the Effect of Pressure and Surface Roughness on Thermal Contact Resistance With LMA As TIM
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Topics: Alloys, Contact resistance, Melting, Pressure, Surface roughness, Temperature
Proceedings Papers

A Model of the Contact Thermal Resistance of Vertical Carbon Nanotube Arrays

Jin Zhang, Bo Shi
Proc. ASME. MNHMT2016, Volume 2: Micro/Nano-Thermal Manufacturing and Materials Processing; Boiling, Quenching and Condensation Heat Transfer on Engineered Surfaces; Computational Methods in Micro/Nanoscale Transport; Heat and Mass Transfer in Small Scale; Micro/Miniature Multi-Phase Devices; Biomedical Applications of Micro/Nanoscale Transport; Measurement Techniques and Thermophysical Properties in Micro/Nanoscale; Posters, V002T10A006, January 4–6, 2016
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2016-6511
https://doi.org/10.1115/MNHMT2016-6511
View Paper titled, A Model of the Contact Thermal Resistance of Vertical Carbon Nanotube Arrays
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Topics: Carbon nanotubes, Thermal resistance, Contact resistance, Interfacial thermal resistance, Surface roughness, Mechanical properties, Molecular dynamics
Proceedings Papers

Experimental Study on Thermal Contact Resistance of Multi-Walled Carbon Nanotubes

Kazunari Tsuru, Yutaka Yamada, Tatsuya Ikuta, Takashi Nishiyama, Koji Takahashi
Proc. ASME. MNHMT2013, ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer, V001T03A003, December 11–14, 2013
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2013-22078
https://doi.org/10.1115/MNHMT2013-22078
View Paper titled, Experimental Study on Thermal Contact Resistance of Multi-Walled Carbon Nanotubes
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Topics: Contact resistance, Multi-walled carbon nanotubes, Temperature, Carbon nanotubes, Computer simulation, Heat transfer, Phonons, Thermal conductivity, Vacuum
Proceedings Papers

Solvent Soaking and Drying of Carbon Nanotube Forests for Enhanced Contact Area and Thermal Interface Conductance

John H. Taphouse, Baratunde A. Cola
Proc. ASME. MNHMT2013, ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer, V001T03A012, December 11–14, 2013
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2013-22225
https://doi.org/10.1115/MNHMT2013-22225
View Paper titled, Solvent Soaking and Drying of Carbon Nanotube Forests for Enhanced Contact Area and Thermal Interface Conductance
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Topics: Carbon nanotubes, Drying, Electrical conductance, Contact resistance, Bonding, Fluids, Mechanical properties, Phonons, Stiffness, Thermal resistance
Proceedings Papers

Applications of Nano Hot-Film Sensor for Micro/Nanoscale Thermal Measurement

Koji Takahashi, Jun Hirotani, Takashi Nishiyama, Tatsuya Ikuta, Hiroshi Takamatsu
Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 677-681, March 3–6, 2012
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2012-75030
https://doi.org/10.1115/MNHMT2012-75030
View Paper titled, Applications of Nano Hot-Film Sensor for Micro/Nanoscale Thermal Measurement
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Topics: Nanoscale phenomena, Sensors, Thermal conductivity, Carbon nanotubes, Contact resistance, Dielectrophoresis, Fins, Flow (Dynamics), Flow sensors, Fluids
Proceedings Papers

Measuring the Thermal Contact Resistance of a Junction by T Type Probe Method

Jianli Wang, Ming Gu, Xing Zhang
Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 2, 427-434, December 18–21, 2009
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2009-18293
https://doi.org/10.1115/MNHMT2009-18293
View Paper titled, Measuring the Thermal Contact Resistance of a Junction by T Type Probe Method
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Topics: Contact resistance, Junctions, Probes
Proceedings Papers

Thermal Properties of Thin Metallic Layer Deposited on Insulators: Effect of the Interface on the Independent Determination of the Thermal Diffusivity and Conductivity of the Layer

Danie`le Fournier, Jean Paul Roger, Christian Fretigny
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 905-906, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52298
https://doi.org/10.1115/MNHT2008-52298
View Paper titled, Thermal Properties of Thin Metallic Layer Deposited on Insulators: Effect of the Interface on the Independent Determination of the Thermal Diffusivity and Conductivity of the Layer
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Topics: Thermal conductivity, Thermal diffusivity, Thermal properties, Thermal resistance, Adhesion, Thermal diffusion, Coating processes, Coatings, Contact resistance, Heat
Proceedings Papers

Effects of High Current Density at Nanoscale Point Contacts

Hsinyi Lo, James A. Bain
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 493-502, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52349
https://doi.org/10.1115/MNHT2008-52349
View Paper titled, Effects of High Current Density at Nanoscale Point Contacts
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Topics: Atomic force microscopy, Current density, Electrodiffusion, Nanoscale phenomena, Probes, Melting, Coating processes, Coatings, Contact resistance, Damage
Proceedings Papers

Finite Element Modeling of Multi-Scale Thermal Contact Resistance

M. K. Thompson
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 509-517, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52385
https://doi.org/10.1115/MNHT2008-52385
View Paper titled, Finite Element Modeling of Multi-Scale Thermal Contact Resistance
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Topics: Contact resistance, Finite element analysis, Modeling, Surface roughness
Proceedings Papers

Molecular Dynamics Modeling of the Effect of Thermal Interface Material on Thermal Contact Conductance

U. B. Jayadeep, R. Krishna Sabareesh, R. Nirmal, K. V. Rijin, C. B. Sobhan
Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 1351-1355, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52204
https://doi.org/10.1115/MNHT2008-52204
View Paper titled, Molecular Dynamics Modeling of the Effect of Thermal Interface Material on Thermal Contact Conductance
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Topics: Contact resistance, Modeling, Molecular dynamics