An effective thermal spreader can achieve more uniform heat flux distribution and thus enhance heat dissipation of heat sinks. Vapor chamber is one of highly effective thermal spreaders. In this paper, a novel grooved vapor chamber was designed. The grooved structure of the vapor chamber can improve its axial and radial heat transfer and also can form the capillary loop between condensation and evaporation surfaces. A two dimensional heat and mass transfer model for the grooved vapor chamber is developed. The numerical simulation results show the thickness distribution of liquid film in the grooves is not uniform. The temperature and velocity field in vapor chamber are obtained. The thickness of the liquid film in groove is mainly influenced by pressure of vapor and liquid beside liquid-vapor interface. The thin liquid film in heat source region can enhance the performance of vapor chamber, but if the starting point of liquid film is backward beyond the heat source region, the vapor chamber will dry out easily. The optimal filling ratio should maintain steady thin liquid film in heat source region of vapor chamber. The vapor condenses on whole condensation surface, so the condensation surface achieves great uniform temperature distribution. By comparing the experimental results with numerical simulation results, the reliability of the numerical model can be verified.
Skip Nav Destination
ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer
June 6–9, 2008
Tainan, Taiwan
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4292-4
PROCEEDINGS PAPER
Numerical Investigation of a Novel Grooved Vapor Chamber Available to Purchase
Ming Zhang,
Ming Zhang
Beijing University of Technology, Beijing, China
Search for other works by this author on:
Zhongliang Liu,
Zhongliang Liu
Beijing University of Technology, Beijing, China
Search for other works by this author on:
Guoyuan Ma
Guoyuan Ma
Beijing University of Technology, Beijing, China
Search for other works by this author on:
Ming Zhang
Beijing University of Technology, Beijing, China
Zhongliang Liu
Beijing University of Technology, Beijing, China
Guoyuan Ma
Beijing University of Technology, Beijing, China
Paper No:
MNHT2008-52017, pp. 923-929; 7 pages
Published Online:
June 22, 2009
Citation
Zhang, M, Liu, Z, & Ma, G. "Numerical Investigation of a Novel Grooved Vapor Chamber." Proceedings of the ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer. ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B. Tainan, Taiwan. June 6–9, 2008. pp. 923-929. ASME. https://doi.org/10.1115/MNHT2008-52017
Download citation file:
19
Views
Related Proceedings Papers
Passive Direct Liquid Cooling for High-Power Processors
InterPACK2024
Related Articles
Experimental Research on an Embedded Heat Source Vapor Chamber for Aerospace Electronic Cooling
J. Thermal Sci. Eng. Appl (May,2024)
Thermal Performance of Nanofluid Charged Heat Pipe With Phase Change Material for Electronics Cooling
J. Electron. Packag (June,2015)
Novel Design of a Miniature Loop Heat Pipe Evaporator for Electronic Cooling
J. Heat Transfer (October,2007)
Related Chapters
A Dependable Answer
Hot Air Rises and Heat Sinks: Everything You Know about Cooling Electronics Is Wrong
Scope of Section I, Organization, and Service Limits
Power Boilers: A Guide to the Section I of the ASME Boiler and Pressure Vessel Code, Second Edition
Case Study 8: Horizontal Tank Vapor–Liquid Separator
Engineering Optimization: Applications, Methods, and Analysis