Thermal conductivities for single-walled carbon nanotubes (SWNTs) filled with water are calculated with non-equilibrium molecular dynamics (NEMD) simulation method. Simulation results demonstrate the thermal conduction for the tube filed with water is better than the pure nanotube at the same conditions. It is believed the translational movement of the water molecules along the tube axis helps carry energy from the hot bath to the heat sinks, which results in the increase of the thermal conductivities. In addition, with the introduction of the water molecules into the nanotube, the additional interaction between the carbon atoms and the water molecules provide extra channels for phonon transport, which further intensifies the energy transport along the nanotubes. The effects of the temperature variation and the tube length on the thermal conductivities are also analyzed in this paper.
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ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer
June 6–9, 2008
Tainan, Taiwan
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4292-4
PROCEEDINGS PAPER
Molecular Dynamics Simulation of Thermal Conductivity of Single-Walled Carbon Nanotubes Filled With Water
Yunfei Chen,
Yunfei Chen
Southeast University, Nanjing, China
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Ruiming Qian,
Ruiming Qian
Southeast University, Nanjing, China
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Juekuan Yang,
Juekuan Yang
Southeast University, Nanjing, China
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Kedong Bi
Kedong Bi
Southeast University, Nanjing, China
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Li Deng
Southeast University, Nanjing, China
Yunfei Chen
Southeast University, Nanjing, China
Ruiming Qian
Southeast University, Nanjing, China
Juekuan Yang
Southeast University, Nanjing, China
Kedong Bi
Southeast University, Nanjing, China
Paper No:
MNHT2008-52104, pp. 9-13; 5 pages
Published Online:
June 22, 2009
Citation
Deng, L, Chen, Y, Qian, R, Yang, J, & Bi, K. "Molecular Dynamics Simulation of Thermal Conductivity of Single-Walled Carbon Nanotubes Filled With Water." Proceedings of the ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer. ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B. Tainan, Taiwan. June 6–9, 2008. pp. 9-13. ASME. https://doi.org/10.1115/MNHT2008-52104
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