A novel technique for the fabrication of electromagnetic micro actuators was proposed and a prototype was designed and fabricated in this study. The constituent parts of the designed actuator are comprised of the diaphragm, the micro coils, and the magnet. When an electrical current was applied to the micro coils, the magnetic force between the magnet and the coil is produced, causes the diaphragm to deflect and becomes the source of actuation. The fabrication process of the actuator combines Optical Lithography, Electron Beam Evaporation, and Electroplating. The structure of the actuating device uses PDMS as the vibrating diaphragm and electroplated copper as the coils. The diaphragm deflection can be regulated by varying the electrical current passed through the micro coil and hence the actuating effects can be controlled. The experimental results show that the maximum diaphragm deflection within elastic limits is 150 μm at an electrical current of 0.6 A for a micro coil of 100 μm line width. The micro electromagnetic actuator proposed in this study is easily fabricated and is readily integrated with Lab-on-a-Chip systems due to its planar structure.
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ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer
June 6–9, 2008
Tainan, Taiwan
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4292-4
PROCEEDINGS PAPER
An Electromagnetic Actuator in Lab-on-a-Chip Systems
Chia-Yen Lee,
Chia-Yen Lee
Da-Yeh University, Changhua, Taiwan
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Zgen-Hui Chen,
Zgen-Hui Chen
Da-Yeh University, Changhua, Taiwan
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Chih-Yung Wen
Chih-Yung Wen
Cheng Kung University, Tainan, Taiwan
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Chia-Yen Lee
Da-Yeh University, Changhua, Taiwan
Zgen-Hui Chen
Da-Yeh University, Changhua, Taiwan
Chih-Yung Wen
Cheng Kung University, Tainan, Taiwan
Paper No:
MNHT2008-52037, pp. 73-76; 4 pages
Published Online:
June 22, 2009
Citation
Lee, C, Chen, Z, & Wen, C. "An Electromagnetic Actuator in Lab-on-a-Chip Systems." Proceedings of the ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer. ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B. Tainan, Taiwan. June 6–9, 2008. pp. 73-76. ASME. https://doi.org/10.1115/MNHT2008-52037
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