A computational model was developed to analyze and optimize the convective heat transfer for water flowing through rectangular microchannels fabricated in a silicon substrate. A baseline case was analyzed by solving the nondimensional governing equations. Using a quasi three-dimensional computational model, the velocity and temperature distributions were obtained and the numerical results were then used to determine the overall dimensionless thermal resistance for the convective heat transfer from the substrate to the fluid. To validate the numerical model, the average Nusselt numbers as determined by the numerical model were compared with experimental results available in the literature, for channels with comparable hydraulic diameters. The procedure for arriving at an optimum geometric configuration and arrangement of microchannels on the substrate, subject to given design constraints, so that the thermal resistance is at a minimum, is described and demonstrated using the computational model.
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ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer
June 6–9, 2008
Tainan, Taiwan
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4292-4
PROCEEDINGS PAPER
Microchannel Optimization for Heat Dissipation From a Solid Substrate Available to Purchase
C. B. Sobhan,
C. B. Sobhan
National Institute of Technology, Calicut, India
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P. S. Anoop,
P. S. Anoop
National Institute of Technology, Calicut, India
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Kuriyan Arimboor,
Kuriyan Arimboor
National Institute of Technology, Calicut, India
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Thomas Abraham,
Thomas Abraham
National Institute of Technology, Calicut, India
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G. P. Peterson
G. P. Peterson
University of Colorado at Boulder, Boulder, CO
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C. B. Sobhan
National Institute of Technology, Calicut, India
P. S. Anoop
National Institute of Technology, Calicut, India
Kuriyan Arimboor
National Institute of Technology, Calicut, India
Thomas Abraham
National Institute of Technology, Calicut, India
G. P. Peterson
University of Colorado at Boulder, Boulder, CO
Paper No:
MNHT2008-52117, pp. 671-677; 7 pages
Published Online:
June 22, 2009
Citation
Sobhan, CB, Anoop, PS, Arimboor, K, Abraham, T, & Peterson, GP. "Microchannel Optimization for Heat Dissipation From a Solid Substrate." Proceedings of the ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer. ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B. Tainan, Taiwan. June 6–9, 2008. pp. 671-677. ASME. https://doi.org/10.1115/MNHT2008-52117
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