Nanofluids have been attractive for the last few years with the enormous potential to improve the efficiency of heat transfer fluids. This work focuses on the effect of pH and sodium dodecylbenzenesulfonate (SDBS) surfactant on the thermal conductivity of nanofluids.The thermal conductivity was measured by a Hot Disk Thermal Constants Anlyser. The results showed that the thermal conductivity enhancements of Cu–H2O nanofluids are highly dependent on the weight fraction of nanoparticle, pH values and SDBS surfactant concentration of nano-suspensions. The Cu–H2O nanofluids with an ounce of Cu have noticeably higher thermal conductivity than the base fluid without nanoparticles, For Cu nanoparticles at a weight fraction of 0.001 (0.1 wt %), thermal conductivity was enhanced by up to 10.7%, with an optimal pH value and SDBS concentration for the highest thermal conductivity. Therefore, the combined treatment with both the pH and chemical surfactant is recommended to improve the thermal conductivity for practical applications of nanofluid.
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ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer
June 6–9, 2008
Tainan, Taiwan
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4292-4
PROCEEDINGS PAPER
Effect of pH and Chemical Surfactant on Thermal Conductivity Enhancement of Cu-H2O Nanofluids
Xinfang Li,
Xinfang Li
South China University of Technology, Guangzhou, Guangdong, China
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Dongsheng Zhu,
Dongsheng Zhu
South China University of Technology, Guangzhou, Guangdong, China
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Xianju Wang,
Xianju Wang
South China University of Technology; Navy Arms of Services Command Academy, Guangzhou, Guangdong, China
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Nan Wang,
Nan Wang
South China University of Science Technology, Guangzhou, Guangdong, China
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Zhengdong Wang,
Zhengdong Wang
East China University of Science Technology, Shanghai, China
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Shandong Tu
Shandong Tu
East China University of Technology, Shanghai, China
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Xinfang Li
South China University of Technology, Guangzhou, Guangdong, China
Dongsheng Zhu
South China University of Technology, Guangzhou, Guangdong, China
Xianju Wang
South China University of Technology; Navy Arms of Services Command Academy, Guangzhou, Guangdong, China
Nan Wang
South China University of Science Technology, Guangzhou, Guangdong, China
Zhengdong Wang
East China University of Science Technology, Shanghai, China
Shandong Tu
East China University of Technology, Shanghai, China
Paper No:
MNHT2008-52271, pp. 569-573; 5 pages
Published Online:
June 22, 2009
Citation
Li, X, Zhu, D, Wang, X, Wang, N, Wang, Z, & Tu, S. "Effect of pH and Chemical Surfactant on Thermal Conductivity Enhancement of Cu-H2O Nanofluids." Proceedings of the ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer. ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B. Tainan, Taiwan. June 6–9, 2008. pp. 569-573. ASME. https://doi.org/10.1115/MNHT2008-52271
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