Many traditional macro scale finite element models of thermal contact systems have incorporated the effect of micro scale surface topography by applying a constant value of thermal contact conductance (TCC) per unit area to the regions in contact. However, it has been very difficult to determine an appropriate TCC value for a given system and analysts typically had to rely on experimental data or values from the literature. This work presents a method for predicting micro scale TCC per unit area by incorporating micro scale surface roughness in a multi-scale iterative thermal/structural finite element contact model. The resulting TCC value is then used in a macro scale thermal/structural contact model with apparent surface form to predict the thermal contact resistance and overall thermal resistance for a commercial power electronics module.
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ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer
June 6–9, 2008
Tainan, Taiwan
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4292-4
PROCEEDINGS PAPER
Finite Element Modeling of Multi-Scale Thermal Contact Resistance
M. K. Thompson
M. K. Thompson
Korea Advanced Institute of Science and Technology, Daejeon, South Korea
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M. K. Thompson
Korea Advanced Institute of Science and Technology, Daejeon, South Korea
Paper No:
MNHT2008-52385, pp. 509-517; 9 pages
Published Online:
June 22, 2009
Citation
Thompson, MK. "Finite Element Modeling of Multi-Scale Thermal Contact Resistance." Proceedings of the ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer. ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B. Tainan, Taiwan. June 6–9, 2008. pp. 509-517. ASME. https://doi.org/10.1115/MNHT2008-52385
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