This work experimentally investigates the evaporation rates of water drops on surfaces of various wettability. By measuring the temporal evolutions of the drop radius and contact angle, we find the qualitative difference between the evaporation behavior on hydrophilic surfaces where the contact radius remains constant initially and that on the superhydrophobic surfaces where the contact angle remains constant. Also, the evaporation rate is observed to depend on the surface material although the currently available models assume that the rate is solely determined by the drop geometry. Although the theory to explain this dependence on the surface remains to be pursued by the future work, we give the empirical relations that can be used to predict the drop volume evolution for each surface.
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ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer
June 6–9, 2008
Tainan, Taiwan
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4292-4
PROCEEDINGS PAPER
Sessile Drop Evaporation on Surfaces of Various Wettability
Hyunsoo Song,
Hyunsoo Song
Seoul National University, Seoul, South Korea
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Yongku Lee,
Yongku Lee
University of Calgary, Calgary, Alberta, Canada
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Songwan Jin,
Songwan Jin
University of California at San Francisco, San Francisco, CA
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Ho-Young Kim,
Ho-Young Kim
Seoul National University, Seoul, South Korea
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Jung Yul Yoo
Jung Yul Yoo
Seoul National University, Seoul, South Korea
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Hyunsoo Song
Seoul National University, Seoul, South Korea
Yongku Lee
University of Calgary, Calgary, Alberta, Canada
Songwan Jin
University of California at San Francisco, San Francisco, CA
Ho-Young Kim
Seoul National University, Seoul, South Korea
Jung Yul Yoo
Seoul National University, Seoul, South Korea
Paper No:
MNHT2008-52096, pp. 445-451; 7 pages
Published Online:
June 22, 2009
Citation
Song, H, Lee, Y, Jin, S, Kim, H, & Yoo, JY. "Sessile Drop Evaporation on Surfaces of Various Wettability." Proceedings of the ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer. ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B. Tainan, Taiwan. June 6–9, 2008. pp. 445-451. ASME. https://doi.org/10.1115/MNHT2008-52096
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