Heat transport in nanostructured material is a critical issue in the design of electronic devices. According to the size and the temperature, thermal properties of the considered medium can change. In order to appraise these modifications new simulation techniques based on phonon transport equation solution have been developed. In this field, the Monte Carlo method dedicated to phonon motion and collision modeling has prove to be efficient. In the present paper we propose a modified form of this method that takes into account short pulse heating in order to assess specific heat c and thermal conductivity k. The parameter assessment has been done using Laplace analysis of the Monte Carlo calculated temperature profiles at short and long times through asymptotic solutions fitting. These numerical tools have demonstrated to be efficient as c and k values obtained for bulk silicon at low and room temperatures confirmed it.
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ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer
June 6–9, 2008
Tainan, Taiwan
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4292-4
PROCEEDINGS PAPER
Monte Carlo Simulation of Heat Pulse Propagation in Silicon Nanostructure
David Lacroix,
David Lacroix
Nancy Universite´, Vandœuvre les Nancy, France
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Karl Joulain,
Karl Joulain
LET ENSMA, Futuroscope Chasseneuil, France
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Gilles Parent,
Gilles Parent
Nancy Universite´, Vandœuvre les Nancy, France
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Sebastien Fumeron
Sebastien Fumeron
Nancy Universite´, Vandœuvre les Nancy, France
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David Lacroix
Nancy Universite´, Vandœuvre les Nancy, France
Karl Joulain
LET ENSMA, Futuroscope Chasseneuil, France
Gilles Parent
Nancy Universite´, Vandœuvre les Nancy, France
Sebastien Fumeron
Nancy Universite´, Vandœuvre les Nancy, France
Paper No:
MNHT2008-52101, pp. 339-346; 8 pages
Published Online:
June 22, 2009
Citation
Lacroix, D, Joulain, K, Parent, G, & Fumeron, S. "Monte Carlo Simulation of Heat Pulse Propagation in Silicon Nanostructure." Proceedings of the ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer. ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B. Tainan, Taiwan. June 6–9, 2008. pp. 339-346. ASME. https://doi.org/10.1115/MNHT2008-52101
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