Energy accommodation coefficient (EAC), used in thermal boundary condition in micro gas flow and heat transfer, is reported to be always less than unity and greatly influenced by the wall characters. According to EAC’s definition, the statistical algorithm was described and EAC for argon gas was studied by two dimensional NEMD simulations with heat conduction between two smooth platinum plates at different temperatures. With one wall’s temperature fixed, the non-equilibrium EACs were calculated by changing the other wall’s temperature. Meanwhile, the equilibrium EAC at one temperature can be extrapolated from a series of non-equilibrium EACs as the temperature difference approaches to zero. The effects of wall temperature, wall temperature difference, and Kn on EAC were investigated. Non-equilibrium EAC increases with wall temperature difference decreased, and becomes larger with increased Kn. And equilibrium EAC is larger for lower temperature and larger Kn.
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ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer
June 6–9, 2008
Tainan, Taiwan
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4292-4
PROCEEDINGS PAPER
A Molecular Dynamics Study on Energy Accommodation Coefficients in Microchannels
Jun Sun
Tsinghua University, Beijing, China
Zhixin Li
Tsinghua University, Beijing, China
Paper No:
MNHT2008-52053, pp. 333-337; 5 pages
Published Online:
June 22, 2009
Citation
Sun, J, & Li, Z. "A Molecular Dynamics Study on Energy Accommodation Coefficients in Microchannels." Proceedings of the ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer. ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B. Tainan, Taiwan. June 6–9, 2008. pp. 333-337. ASME. https://doi.org/10.1115/MNHT2008-52053
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