This paper introduces a high performance vapor chamber heat spreader with a novel bi-dispersed wick structure. The main wick structure is a sintered porous network in a latticed pattern, which contains not only small pores to transport liquid by capillary forces, but also many slots to provide large passages to vent vapor from heated surfaces. The copper particles have a diameter of approximately 50 μm; they produce an effective pore radius of approximately 13 μm after sintering. The slots have a typical width of approximately 500 μm. Unlike traditional bi-dispersed wick structures, the latticed wick structures provide undisrupted liquid delivery passages and vapor escape channels and thus greatly improve the heat transfer performance. Preliminary experimental tests were conducted and the results were analyzed. It was shown by the experiments that vapor chamber heat spreaders with the latticed wicks present three times improvement on heat spreading performance, comparing with a solid copper heat spreader, and much improved capacity to handle hot spots with local heat fluxes exceeding 300 W/cm2, which will have great impacts on extending heat pipe technology from traditional low to medium heat fluxes to high heat flux applications.
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ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer
June 6–9, 2008
Tainan, Taiwan
Conference Sponsors:
- Nanotechnology Institute
ISBN:
0-7918-4292-4
PROCEEDINGS PAPER
Development of a High Performance Vapor Chamber for High Heat Flux Applications
Yuan Zhao
,
Yuan Zhao
Teledyne Scientific & Imaging Company, Thousand Oaks, CA
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Chung-Lung Chen
Chung-Lung Chen
Teledyne Scientific & Imaging Company, Thousand Oaks, CA
Search for other works by this author on:
Yuan Zhao
Teledyne Scientific & Imaging Company, Thousand Oaks, CA
Chung-Lung Chen
Teledyne Scientific & Imaging Company, Thousand Oaks, CA
Paper No:
MNHT2008-52363, pp. 1023-1028; 6 pages
Published Online:
June 22, 2009
Citation
Zhao, Y, & Chen, C. "Development of a High Performance Vapor Chamber for High Heat Flux Applications." Proceedings of the ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer. ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B. Tainan, Taiwan. June 6–9, 2008. pp. 1023-1028. ASME. https://doi.org/10.1115/MNHT2008-52363
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