A mathematic model, which can be used to predict the evaporation and fluid flow in thin film region, is developed based on momentum and energy conservations and the augmented Young-Laplace equation in this paper. In the model the variations of the enthalpy and kinetics energy of the thin-film along the evaporating region are considered. By theoretical analysis, we have obtained the governing equation for thin film profile. The fluid flow and phase-change heat transfer in an evaporating extended meniscus are numerically studied. The differences between the model considering momentum conservation only and including both momentum and energy conservations are compared. It is found that the maximum heat flux of the thin-film evaporation by using two mathematical models obtained has no change, but when considering the momentum and energy conservations the total heat transfer rate unit width along the thin-film evaporation region is greater than that of only including momentum equation.
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ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer
December 11–14, 2013
Hong Kong, China
Conference Sponsors:
- Heat Transfer Division
ISBN:
978-0-7918-5615-4
PROCEEDINGS PAPER
Mechanisms of Thin-Film Evaporation Considering Momentum and Energy Conservation
Chunji Yan,
Chunji Yan
Dalian Maritime University, Dalian, China
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Xinxiang Pan,
Xinxiang Pan
Dalian Maritime University, Dalian, China
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Xiaowei Lu
Xiaowei Lu
Dalian Maritime University, Dalian, China
Search for other works by this author on:
Chunji Yan
Dalian Maritime University, Dalian, China
Xinxiang Pan
Dalian Maritime University, Dalian, China
Xiaowei Lu
Dalian Maritime University, Dalian, China
Paper No:
MNHMT2013-22157, V001T11A007; 6 pages
Published Online:
February 26, 2014
Citation
Yan, C, Pan, X, & Lu, X. "Mechanisms of Thin-Film Evaporation Considering Momentum and Energy Conservation." Proceedings of the ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer. ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer. Hong Kong, China. December 11–14, 2013. V001T11A007. ASME. https://doi.org/10.1115/MNHMT2013-22157
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