Heat transfer at solid-solid interface is very fascinating where no one knows the full mechanism which has a huge impact in many applications in engineering and science. In many kinds of interfaces, we treat a van der Waals contact of perfectly-smooth surfaces by using multi-walled carbon nanotubes (CNTs). Their thermal contact resistance (TCR) is estimated by comparing measured thermal conductivity of CNT specimen and numerical simulation result. The TCR per unit area is estimated as 1.58∼3.33×10−8 m2K/W at room temperature in vacuum, which is much higher than our previous result in air. It was also found that TCR is inversely proportional with the temperature to the 1.92th power different from the simple phonon model represented by the diffuse mismatch model.
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ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer
December 11–14, 2013
Hong Kong, China
Conference Sponsors:
- Heat Transfer Division
ISBN:
978-0-7918-5615-4
PROCEEDINGS PAPER
Experimental Study on Thermal Contact Resistance of Multi-Walled Carbon Nanotubes
Kazunari Tsuru,
Kazunari Tsuru
Kyushu University, Fukuoka, Japan
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Yutaka Yamada,
Yutaka Yamada
Kyushu University, Fukuoka, Japan
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Tatsuya Ikuta,
Tatsuya Ikuta
Kyushu University, Fukuoka, Japan
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Takashi Nishiyama,
Takashi Nishiyama
Kyushu University, Fukuoka, Japan
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Koji Takahashi
Koji Takahashi
Kyushu University, Fukuoka, Japan
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Kazunari Tsuru
Kyushu University, Fukuoka, Japan
Yutaka Yamada
Kyushu University, Fukuoka, Japan
Tatsuya Ikuta
Kyushu University, Fukuoka, Japan
Takashi Nishiyama
Kyushu University, Fukuoka, Japan
Koji Takahashi
Kyushu University, Fukuoka, Japan
Paper No:
MNHMT2013-22078, V001T03A003; 5 pages
Published Online:
February 26, 2014
Citation
Tsuru, K, Yamada, Y, Ikuta, T, Nishiyama, T, & Takahashi, K. "Experimental Study on Thermal Contact Resistance of Multi-Walled Carbon Nanotubes." Proceedings of the ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer. ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer. Hong Kong, China. December 11–14, 2013. V001T03A003. ASME. https://doi.org/10.1115/MNHMT2013-22078
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