We have developed a microcantilever-based technique for measurement of heat conduction through individual nanowires. We fabricated silicon nitride cantilevers with nominal dimensions of length 100 μm, width 2–6 μm, and thickness 130 nm. Cantilever chips are designed with multiple cantilevers spaced at varying distances. With a reflective aluminum coating of optimized thickness, these bimaterial cantilevers can be used as ultrasensitive thermal sensors capable of measuring very small heat flux through a nanostructure fixed between two cantilevers. The ultrasensitive bimaterial cantilevers designed in this work are not limited to heat conduction measurements, but will also be useful for measuring near-field radiative heat transfer between a sphere, attached to the tip of the cantilever, and a flat plate.
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ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer
March 3–6, 2012
Atlanta, Georgia, USA
Conference Sponsors:
- Nanotechnology Institute
ISBN:
978-0-7918-5477-8
PROCEEDINGS PAPER
Ultrasensitive Bimaterial Cantilevers Optimized for Nanowire Heat Conduction Measurement
Carlo Canetta,
Carlo Canetta
Columbia University, New York, NY
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Arvind Narayanaswamy
Arvind Narayanaswamy
Columbia University, New York, NY
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Carlo Canetta
Columbia University, New York, NY
Ning Gu
Columbia University, New York, NY
Arvind Narayanaswamy
Columbia University, New York, NY
Paper No:
MNHMT2012-75169, pp. 707-712; 6 pages
Published Online:
July 18, 2013
Citation
Canetta, C, Gu, N, & Narayanaswamy, A. "Ultrasensitive Bimaterial Cantilevers Optimized for Nanowire Heat Conduction Measurement." Proceedings of the ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer. ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer. Atlanta, Georgia, USA. March 3–6, 2012. pp. 707-712. ASME. https://doi.org/10.1115/MNHMT2012-75169
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