Heat conduction between two parallel solid walls separated by liquid argon is investigated using three-dimensional molecular dynamics (MD) simulations. Liquid argon molecules confined in silver and graphite nano-channels are examined separately. Heat flux and temperature distribution within the nano-channels are calculated by maintaining a fixed temperature difference between the two solid surfaces. Temperature profiles are linear sufficiently away from the walls, and heat transfer in liquid argon obeys the Fourier law. Temperature jump due to the interface thermal resistance (i.e., Kapitza length) is characterized as a function of the wall temperature. MD results enabled development of a phenomenological model for the Kapitza length, which is utilized as the coefficient of a Navier-type temperature jump boundary condition using continuum heat conduction equation. Analytical solution of this model results in successful predictions of temperature distribution in liquid-argon confined in silver and graphite nano-channels as thin as 7 nm and 3.57 nm, respectively.
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ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer
March 3–6, 2012
Atlanta, Georgia, USA
Conference Sponsors:
- Nanotechnology Institute
ISBN:
978-0-7918-5477-8
PROCEEDINGS PAPER
Heat Conduction and Interface Thermal Resistance in Liquid Argon Filled Silver and Graphite Nanochannels
Murat Barisik,
Murat Barisik
Old Dominion University, Norfolk, VA
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Ziyuan Shi,
Ziyuan Shi
Old Dominion University, Norfolk, VA
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Ali Beskok
Ali Beskok
Old Dominion University, Norfolk, VA
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Murat Barisik
Old Dominion University, Norfolk, VA
Ziyuan Shi
Old Dominion University, Norfolk, VA
Ali Beskok
Old Dominion University, Norfolk, VA
Paper No:
MNHMT2012-75231, pp. 311-319; 9 pages
Published Online:
July 18, 2013
Citation
Barisik, M, Shi, Z, & Beskok, A. "Heat Conduction and Interface Thermal Resistance in Liquid Argon Filled Silver and Graphite Nanochannels." Proceedings of the ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer. ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer. Atlanta, Georgia, USA. March 3–6, 2012. pp. 311-319. ASME. https://doi.org/10.1115/MNHMT2012-75231
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