In this paper, the silicon-based corrugated microchannels used for the heat transfer enhancement were fabricated by MEMS technology for the first time. Both the flow and convective heat transfer characteristics of the deionized water through these corrugated microchannels were investigated experimentally, and comparisons were performed between corrugated microchannels and straight microchannels with the same cross-sectional aspect ratio (height-to-width ratio) and same hydraulic diameter. Experimental results showed that both the flow friction and Nusselt number in corrugated microchannels increased considerably compared with those in straight microchannels, and this increase became enlarged with the increase in the Reynolds number. With the same pumping power, using corrugated microchannels instead of straight microchannels caused the reduction in the total thermal resistance. The heat transfer enhancement mechanism of the corrugated microchannels was discussed. The results presented in this paper help to design the high efficiency integrated chip cooling system.
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ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer
December 18–21, 2009
Shanghai, China
Conference Sponsors:
- Nanotechnology Institute
ISBN:
978-0-7918-4391-8
PROCEEDINGS PAPER
Experimental Study of Flow and Heat Transfer Characteristics in Silicon-Based Corrugated Microchannels
Huimin Tang,
Huimin Tang
Shanghai Jiao Tong University, Shanghai, China
Search for other works by this author on:
Huiying Wu
Huiying Wu
Shanghai Jiao Tong University, Shanghai, China
Search for other works by this author on:
Huimin Tang
Shanghai Jiao Tong University, Shanghai, China
Huiying Wu
Shanghai Jiao Tong University, Shanghai, China
Paper No:
MNHMT2009-18527, pp. 635-641; 7 pages
Published Online:
October 26, 2010
Citation
Tang, H, & Wu, H. "Experimental Study of Flow and Heat Transfer Characteristics in Silicon-Based Corrugated Microchannels." Proceedings of the ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer. ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 3. Shanghai, China. December 18–21, 2009. pp. 635-641. ASME. https://doi.org/10.1115/MNHMT2009-18527
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