The rapid emergence of nanoelectronics, with the consequent rise in transistor density and switching speed, has led to a steep increase in microprocessor chip heat flux and growing concern over the emergence of on-chip “hot spots”. The application of on-chip high heat flux cooling techniques is today a primary driver for innovation in the electronics industry. In this paper, the physical phenomena underpinning the most promising on-chip thermal management approaches for hot spot remediation, along with basic modeling equations and typical results are described. Attention is devoted to thermoelectric microcoolers — using mini-contcat enhancement and in-plane thermoelectric currents, orthotropic TIM’s/heat spreaders, and phase-change microgap coolers.
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ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer
December 18–21, 2009
Shanghai, China
Conference Sponsors:
- Nanotechnology Institute
ISBN:
978-0-7918-4391-8
PROCEEDINGS PAPER
Thermal Management of On-Chip Hot Spot
Avram Bar-Cohen,
Avram Bar-Cohen
University of Maryland at College Park, College Park, MD
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Peng Wang
Peng Wang
University of Maryland at College Park, College Park, MD
Search for other works by this author on:
Avram Bar-Cohen
University of Maryland at College Park, College Park, MD
Peng Wang
University of Maryland at College Park, College Park, MD
Paper No:
MNHMT2009-18548, pp. 553-567; 15 pages
Published Online:
October 26, 2010
Citation
Bar-Cohen, A, & Wang, P. "Thermal Management of On-Chip Hot Spot." Proceedings of the ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer. ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 3. Shanghai, China. December 18–21, 2009. pp. 553-567. ASME. https://doi.org/10.1115/MNHMT2009-18548
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