This article presents the development of silicon based heat spreader devices, called hexcells. Several key technical aspects, including the hexcell MEMS fabrication process, mechanical strength studies, vacuum sealing technique, and phase change and mass transport visualization, have been developed and studied. The hexcell development prototypes are fabricated by MEMS photolithography and dry-etch processes, with eutectic bonding to form a sealed silicon chamber with openings for charging with the working fluid. Using Ansys as the modeling tool, we optimized the hexcell total mechanical strength by incorporating six interior support posts to reinforce the structure. In terms of the optimized design, experimental results on actual hexcell samples show that a well-bonded hexcell can withstand over 60psi without destructive failure. Vacuum sealing are divided into helium and vapor leakage tests. With metalized and solder-sealed sidewalls, both testing results confirm good vacuum sealing. The wick structure used in the present hexcell is silicon pillars with dimensions of 50μm in diameter and 250μm in height. The pillars are etched before the hexcell is bonded and formed. Experiments using the silicon wick structure demonstrate over 300W/cm2 cooling capacity and visualization shows the intensive phase change on the heating area.
Skip Nav Destination
ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer
December 18–21, 2009
Shanghai, China
Conference Sponsors:
- Nanotechnology Institute
ISBN:
978-0-7918-4391-8
PROCEEDINGS PAPER
Development of Silicon Based Heat Spreader for High Power Electronic Devices Available to Purchase
Qingjun Cai,
Qingjun Cai
Teledyne Scientific & Image Co., Thousand Oaks, CA
Search for other works by this author on:
Bing-chung Chen,
Bing-chung Chen
Teledyne Scientific & Image Co., Thousand Oaks, CA
Search for other works by this author on:
Chailun Tsai,
Chailun Tsai
Teledyne Scientific & Image Co., Thousand Oaks, CA
Search for other works by this author on:
Yuan Zhao,
Yuan Zhao
Teledyne Scientific & Image Co., Thousand Oaks, CA
Search for other works by this author on:
Chung-lung Chen
Chung-lung Chen
Teledyne Scientific & Image Co., Thousand Oaks, CA
Search for other works by this author on:
Qingjun Cai
Teledyne Scientific & Image Co., Thousand Oaks, CA
Bing-chung Chen
Teledyne Scientific & Image Co., Thousand Oaks, CA
Chailun Tsai
Teledyne Scientific & Image Co., Thousand Oaks, CA
Yuan Zhao
Teledyne Scientific & Image Co., Thousand Oaks, CA
Chung-lung Chen
Teledyne Scientific & Image Co., Thousand Oaks, CA
Paper No:
MNHMT2009-18499, pp. 443-448; 6 pages
Published Online:
October 26, 2010
Citation
Cai, Q, Chen, B, Tsai, C, Zhao, Y, & Chen, C. "Development of Silicon Based Heat Spreader for High Power Electronic Devices." Proceedings of the ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer. ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 3. Shanghai, China. December 18–21, 2009. pp. 443-448. ASME. https://doi.org/10.1115/MNHMT2009-18499
Download citation file:
13
Views
Related Proceedings Papers
Related Articles
Development of Scalable Silicon Heat Spreader for High Power Electronic Devices
J. Thermal Sci. Eng. Appl (December,2009)
Thermal Performance of Integrated Plate Heat Pipe With a Heat Spreader
J. Electron. Packag (September,2001)
Two-Phase Thermal Ground Planes: Technology Development and Parametric Results
J. Electron. Packag (March,2015)
Related Chapters
Heat Pipes
Thermal Management of Microelectronic Equipment
Analysis of the Affect of Heat Pipe Line Engineering Construction on the Settlement and Deformation Tunnels of Beijing Subway Line 10
Geological Engineering: Proceedings of the 1 st International Conference (ICGE 2007)
Heat Pipes and Others
Thermal Management of Microelectronic Equipment, Second Edition