Focus on solving the increasing heat fluxes in the electronic industry, vapor chamber shows its excellent characteristic as an effective heat spreading device. A serial of vapor chambers made of copper-water and using mesh as the wick material had been manufactured in this paper. The dimension of the vapor chambers are all 95mm*70mm*3.2mm. A remote method was used to test the performance of the vapor chambers, where the property of evaporation and vapor transportation will be mainly studied. Results show that the adiabatic resistance (vapor transportation) can be less than 0.05°C/W at high heat flux, which means the temperature is almost uniform on the top wall of the vapor chamber. The evaporation heat transfer coefficient could be higher than 20000W/m2K. But compared with the small size of heated zone, the evaporation thermal resistant might be still the largest one in the vapor chambers. The orientations have no obviously effect on the performance of the vapor chamber. As the vapor chamber is small, the gravity effect is not obvious here. The flatness of the mesh may become worse during the operation. To solve this problem, at least two ways can be performed. One is to use some support to keep the mesh attached closed to the wall, and the other is to use the diffusion banding. Finally, we use the experiment data to estimate the thermal resistance of vapor chamber as a heat sink base, and compare with the solid copper to see the potential opportunity to use the vapor chamber.
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ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer
December 18–21, 2009
Shanghai, China
Conference Sponsors:
- Nanotechnology Institute
ISBN:
978-0-7918-4391-8
PROCEEDINGS PAPER
Heat Transfer Characteristic of Meshed Vapor Chamber
Dong-chuan Mo,
Dong-chuan Mo
Sun Yat-Sen University, Guangzhou, China
Search for other works by this author on:
Shu-shen Lu
Shu-shen Lu
Sun Yat-Sen University, Guangzhou, China
Search for other works by this author on:
Dong-chuan Mo
Sun Yat-Sen University, Guangzhou, China
Shu-shen Lu
Sun Yat-Sen University, Guangzhou, China
Paper No:
MNHMT2009-18474, pp. 417-422; 6 pages
Published Online:
October 26, 2010
Citation
Mo, D, & Lu, S. "Heat Transfer Characteristic of Meshed Vapor Chamber." Proceedings of the ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer. ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 3. Shanghai, China. December 18–21, 2009. pp. 417-422. ASME. https://doi.org/10.1115/MNHMT2009-18474
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