In this study we introduce our numerical and experimental works for the thermal conductivity reduction by using a porous material. Recently thermal conductivity reduction has been one of the key technologies to enhance the figure of merit (ZT) of a thermoelectric material. We carry out numerical calculations of heat conduction in porous materials, such as, phonon Boltzmann transport (BTE), molecular dynamics simulations (MD), in order to investigate the mechanism of the thermal conductivity reduction of a porous material. In the BTE, we applied the periodic boundary conditions with constant heat flux to calculate the effective thermal conductivity of porous materials. In the MD simulation, we calculated phonon properties of Si by using the Stillinger-Weber potential at constant temperature with periodic boundary conditions in the x, y and z directions. Phonon dispersion curves of single crystal of Si calculated from MD results by time-space 2D FFT are agreed well with reference data. Moreover, the effects of nano-porous structures on both the phonon group velocity and the phonon density of states (DOS) are discussed. At last, we made a porous p-type Bi2Te3 by nano-particles prepared by a beads milling method. The thermal conductivity is one-fifth of that of a bulk material as well as keeping the same Seebeck coefficient as the bulk value. However electrical conductivity was much reduced, and the ZT was only 0.048.
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ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer
December 18–21, 2009
Shanghai, China
Conference Sponsors:
- Nanotechnology Institute
ISBN:
978-0-7918-4391-8
PROCEEDINGS PAPER
Heat Conduction of a Porous Material
Koji Miyazaki
Koji Miyazaki
Kyushu Institute of Technology, Kitakyushu, Fukuoka, Japan
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Koji Miyazaki
Kyushu Institute of Technology, Kitakyushu, Fukuoka, Japan
Paper No:
MNHMT2009-18247, pp. 159-166; 8 pages
Published Online:
October 26, 2010
Citation
Miyazaki, K. "Heat Conduction of a Porous Material." Proceedings of the ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer. ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 3. Shanghai, China. December 18–21, 2009. pp. 159-166. ASME. https://doi.org/10.1115/MNHMT2009-18247
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