A modified lattice-dynamical model is proposed to calculate the thermal boundary resistance at the interface between two fcc lattices. The nonequilibrium molecular dynamics (MD) simulation is employed to verify the theoretical calculations. In our physical model, solid crystal argon is set at the left side and the right side structure properties are tunable by setting the atomic mass and the interactive energy strength among atoms with different values. In the case of mass mismatch, the predictions of the lattice-dynamical (LD) model agree well at low temperature while the calculations of the diffuse mismatch model (DMM) based on the detailed phonon dispersion agree well at high temperature with the MD simulations. The modified LD model, considering a partially specular and partially diffuse phonon scattering, can explain the simulations reasonably in the whole temperature rage. The good agreement between the theoretical calculations and the simulations may be attributed to that phonon scattering mechanisms are dominated by elastic scattering at the perfect interfaces. In the case of interactive energy strength mismatch, the simulations are under the predictions of both the theoretical models, which may be attributed to the fact that this mismatch can bring about an outstanding contribution to opening up an inelastic channel for heat transfer at the interfaces.
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ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer
December 18–21, 2009
Shanghai, China
Conference Sponsors:
- Nanotechnology Institute
ISBN:
978-0-7918-4390-1
PROCEEDINGS PAPER
A Modified Thermal Boundary Resistance Model for FCC Structures
Ruijie Zhao,
Ruijie Zhao
Southeast University, Nanjing, China
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Yunfei Chen,
Yunfei Chen
Southeast University, Nanjing, China
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Meihui Lin,
Meihui Lin
Southeast University, Nanjing, China
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Zan Wang
Zan Wang
Southeast University, Nanjing, China
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Ruijie Zhao
Southeast University, Nanjing, China
Yunfei Chen
Southeast University, Nanjing, China
Kedong Bi
Southeast University, Nanjing, China
Meihui Lin
Southeast University, Nanjing, China
Zan Wang
Southeast University, Nanjing, China
Paper No:
MNHMT2009-18175, pp. 659-665; 7 pages
Published Online:
October 26, 2010
Citation
Zhao, R, Chen, Y, Bi, K, Lin, M, & Wang, Z. "A Modified Thermal Boundary Resistance Model for FCC Structures." Proceedings of the ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer. ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 2. Shanghai, China. December 18–21, 2009. pp. 659-665. ASME. https://doi.org/10.1115/MNHMT2009-18175
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