In this paper, the electrowetting dynamics of a droplet on a dielectric surface was investigated numerically by a mathematical model including dynamic contact angle and contact angle hysteresis. The fluid flow is described by laminar N-S equation, the free surface of the droplet is modeled by the Volume of Fluid (VOF) method, and the electrowetting force is incorporated by exerting an electrical force on the cells at the contact line. The Kilster’s model that can deal with both receding and advancing contact angle is adopted. Numerical results indicate that there is overshooting and oscillation of contact radius in droplet spreading process before it ceases the movement when the excitation voltage is high; while the overshooting is not observed for low voltage. The explanation for the contact line overshooting and some special characteristics of variation of contact radius with time were also conducted.
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ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer
December 18–21, 2009
Shanghai, China
Conference Sponsors:
- Nanotechnology Institute
ISBN:
978-0-7918-4390-1
PROCEEDINGS PAPER
Simulation of Spreading Dynamics of a EWOD Droplet With Dynamic Contact Angle and Contact Angle Hysteresis
Fangjun Hong,
Fangjun Hong
Shanghai Jiao Tong University, Shanghai, China
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Ping Cheng,
Ping Cheng
Shanghai Jiao Tong University, Shanghai, China
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Zhen Sun,
Zhen Sun
Shanghai Jiao Tong University, Shanghai, China
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Huiying Wu
Huiying Wu
Shanghai Jiao Tong University, Shanghai, China
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Fangjun Hong
Shanghai Jiao Tong University, Shanghai, China
Ping Cheng
Shanghai Jiao Tong University, Shanghai, China
Zhen Sun
Shanghai Jiao Tong University, Shanghai, China
Huiying Wu
Shanghai Jiao Tong University, Shanghai, China
Paper No:
MNHMT2009-18558, pp. 635-641; 7 pages
Published Online:
October 26, 2010
Citation
Hong, F, Cheng, P, Sun, Z, & Wu, H. "Simulation of Spreading Dynamics of a EWOD Droplet With Dynamic Contact Angle and Contact Angle Hysteresis." Proceedings of the ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer. ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 2. Shanghai, China. December 18–21, 2009. pp. 635-641. ASME. https://doi.org/10.1115/MNHMT2009-18558
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