This paper is directed at the numerical simulation of pressure-driven nitrogen slip flow in long microchannels, focusing on conjugate heat transfer under uniform heat flux wall boundary condition. This problem has not been studied in detail despite its importance in many practical circumstances such as those related to the cooling of electronic devices and localized heat input in materials processing systems. For the gas phase, the two-dimensional momentum and energy equations are solved, considering variable properties, rarefaction, which involves velocity slip, thermal creep and temperature jump, compressibility, and viscous dissipation. For the solid, the energy equation is solved with variable properties. Four different substrate materials are studied, including commercial bronze, silicon nitride, pyroceram and fused silica. The effects of substrate axial conduction, material thermal conductivity and substrate thickness are investigated in detail. It is found that substrate axial conduction leads to a flatter bulk temperature profile along the channel, lower maximum temperature, and lower Nusselt number. The effect of substrate thickness on the conjugate heat transfer is very similar to that of the substrate thermal conductivity. That is, in terms of axial thermal resistance, the increase in substrate thickness has the same impact as that caused by an increase in its thermal conductivity. By comparing the results from constant and variable properties models, it is found that the effects of variation in substrate material properties are negligible.
- Nanotechnology Institute
Conjugate Thermal Transport in Gas Flow in Long Rectangular Microchannels
Sun, Z, & Jaluria, Y. "Conjugate Thermal Transport in Gas Flow in Long Rectangular Microchannels." Proceedings of the ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer. ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 2. Shanghai, China. December 18–21, 2009. pp. 615-623. ASME. https://doi.org/10.1115/MNHMT2009-18458
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