Stress and Temperature Analysis of the Copper Substrate Indented With Nanotubes and Nanocones

It has been shown that nanotubes and nanocones are most effective to make indents with large aspect ratios. Detailed studies in the heat transfer processes under the nano-scale indentation, and the accompanying stress distributions are required much attention. In this study, the copper substrate was indented with a nanotube or nano-cone. It is found that nano-cones may make indents with larger aspect ratios than the nanotubes due to the local shell buckling. Time-domain heat transfer and stress analysis was carried out by using a control-volume technique with an atomic spatial resolution, except near the boundaries. The effect of temperatures and stresses on the changes of the microstructures of the substrate will be discussed.