As the scale of electronic devices decreases, heat transfer analysis and thermal design becomes more important. In particular, heat transfer through various solid thin films is strongly affected by thickness dependence of thermal conductivity and interfacial thermal resistance. Analysis of phonon dynamics based on a linearized Boltzmann transport equation, or the so-called relaxation time approximation, has been widely used, but detailed analysis using molecular dynamics simulation reveals that couplings among various phonon modes can affect the energy transfer. In this study, we propose a DSMC scheme to simulate phonon dynamics starting from the original Boltzmann transport equation. In contrast to the linearized model, this scheme requires no relaxation time as an input parameter, and we can investigate the couplings among phonons with different modes, although we have to assume some appropriate model of phonon-phonon collisions. As a test calculation, energy flux was evaluated for model thin films of various thicknesses, and a phenomenon similar to the Casimir limit was retrieved. This scheme will enable us to include other factors, such as phonon-electron couplings.
Skip Nav Destination
ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer
December 18–21, 2009
Shanghai, China
Conference Sponsors:
- Nanotechnology Institute
ISBN:
978-0-7918-4390-1
PROCEEDINGS PAPER
DSMC for Phonon Transport in Solid Thin Films
Mitsuhiro Matsumoto,
Mitsuhiro Matsumoto
Kyoto University, Kyoto, Japan
Search for other works by this author on:
Masaya Okano
Masaya Okano
Kyoto University, Kyoto, Japan
Search for other works by this author on:
Mitsuhiro Matsumoto
Kyoto University, Kyoto, Japan
Masaya Okano
Kyoto University, Kyoto, Japan
Paper No:
MNHMT2009-18281, pp. 569-575; 7 pages
Published Online:
October 26, 2010
Citation
Matsumoto, M, & Okano, M. "DSMC for Phonon Transport in Solid Thin Films." Proceedings of the ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer. ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 2. Shanghai, China. December 18–21, 2009. pp. 569-575. ASME. https://doi.org/10.1115/MNHMT2009-18281
Download citation file:
6
Views
Related Proceedings Papers
Related Articles
Phonon Heat Conduction in Thin Films: Impacts of Thermal Boundary Resistance and Internal Heat Generation
J. Heat Transfer (April,2001)
Application of Diffuse Mismatch Theory to the Prediction of Thermal Boundary Resistance in Thin-Film High- T c Superconductors
J. Heat Transfer (February,1998)
Modified Method of Characteristics for Simulating Microscale Energy Transport
J. Heat Transfer (October,2004)
Related Chapters
Generating Synthetic Electrocardiogram Signals Withcontrolled Temporal and Spectral Characteristics
Intelligent Engineering Systems through Artificial Neural Networks Volume 18
Surface Analysis and Tools
Tribology of Mechanical Systems: A Guide to Present and Future Technologies
Transient Temperature and Heat Flux Measurement Using Thin-Film Microsensors
Ultrasonic Welding of Lithium-Ion Batteries