Using a T type probe, the effect of the interstitial material (interposer) on the thermal contact resistance of a junction has been estimated by measuring an individual carbon fiber with different interposers, including the solidified metallic powder, lubricant grease, and dry contact as a comparison. For the metallic powder, the thermal contact conductance was obtained to be 3.0 M W m−2 K−1 by changing the fiber length when the same contact between the fiber and the hot wire was maintained. However, this method can only be applicable to the solidified contact, and the stability of the operating temperature is a must in each length measurement. To estimate the thermal contact resistance of the lubricant Apiezon N grease, even a dry contact, an improved T type probe was employed, by applying an alternative current to the hot wire. This method was verified by measuring the same type of carbon fiber in the frequency range of 0.1 to 1Hz based on a Labview-based virtual lock-in measurement system. The same value of the thermal effusivity of the test fiber was obtained with different interposers, and the thermal contact conductances for the dry contact and high vacuum grease were found to be 0.10 M W m−2 K−1 and 0.26 M W m−2 K−1, respectively.
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ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer
December 18–21, 2009
Shanghai, China
Conference Sponsors:
- Nanotechnology Institute
ISBN:
978-0-7918-4390-1
PROCEEDINGS PAPER
Measuring the Thermal Contact Resistance of a Junction by T Type Probe Method Available to Purchase
Jianli Wang,
Jianli Wang
Tsinghua University, Beijing, China
Search for other works by this author on:
Xing Zhang
Xing Zhang
Tsinghua University, Beijing, China
Search for other works by this author on:
Jianli Wang
Tsinghua University, Beijing, China
Ming Gu
Tsinghua University, Beijing, China
Xing Zhang
Tsinghua University, Beijing, China
Paper No:
MNHMT2009-18293, pp. 427-434; 8 pages
Published Online:
October 26, 2010
Citation
Wang, J, Gu, M, & Zhang, X. "Measuring the Thermal Contact Resistance of a Junction by T Type Probe Method." Proceedings of the ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer. ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 2. Shanghai, China. December 18–21, 2009. pp. 427-434. ASME. https://doi.org/10.1115/MNHMT2009-18293
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